24-6575-18
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- Mfr.Part #
- 24-6575-18
- Manufacturer
- Aries Electronics, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN IC DIP SOCKET ZIF 24POS TIN
- Stock
- 30,258
- In Stock ：
- 30,258
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- Manufacturer :
- Aries Electronics, Inc.
- Product Category :
- IC Sockets
- Lead Length :
- 2.794mm
- Mounting Type :
- Through Hole
- Contact Finish Thickness - Post :
- 200.0μin 5.08μm
- Type :
- DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- PCB Contact Pattern :
- RECTANGULAR
- Material Flammability Rating :
- UL94 V-0
- Contact Finish - Mating :
- Tin
- Termination Post Length :
- 0.110 2.78mm
- Additional Feature :
- UL 94V-0
- Pitch - Post :
- 0.100 2.54mm
- Body Breadth :
- 0.9 inch
- Termination :
- Solder
- Operating Temperature (Max) :
- 250°C
- Flammability Rating :
- UL94 V-0
- Pitch - Mating :
- 0.100 2.54mm
- Pbfree Code :
- yes
- Factory Lead Time :
- 6 Weeks
- RoHS Status :
- ROHS3 Compliant
- Terminal Pitch :
- 2.54mm
- Dielectric Withstanding Voltage :
- 1000VAC V
- ECCN Code :
- EAR99
- Contact Material - Mating :
- BERYLLIUM COPPER
- PCB Contact Row Spacing :
- 0.6 mm
- Housing Material :
- Polyphenylene Sulfide (PPS), Glass Filled
- Contact Style :
- SQ PIN-SKT
- Insulation Resistance :
- 1000000000Ohm
- Number of Positions or Pins (Grid) :
- 24 (2 x 12)
- Current Rating :
- 1A
- Number of Contacts :
- 24
- Body Length or Diameter :
- 1.79 inch
- Packaging :
- Bulk
- Series :
- 57
- Body Depth :
- 0.47 inch
- Contact Material - Post :
- BERYLLIUM COPPER
- Number of Positions :
- 24
- Mating Contact Pitch :
- 0.1 inch
- Mount :
- Through Hole
- Feature :
- Closed Frame
- Published :
- 2005
- Contact Finish Thickness - Mating :
- 200.0μin 5.08μm
- Datasheets
- 24-6575-18
24-6575-18 datasheet pdf and Sockets for ICs, Transistors product details from Aries Electronics stock available at Xinshop
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