10108777-10002MLF

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Mfr.Part #
10108777-10002MLF
Manufacturer
Amphenol Communications Solutions
Package / Case
Datasheet
Download
Description
CONN PCI EXP FMALE 98POS 0.039
Stock
36,024
In Stock :
36,024

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Manufacturer :
Amphenol Communications Solutions
Product Category :
Edgeboard Connectors
RoHS Status :
RoHS Compliant
Mount :
Through Hole
Pitch :
0.039 1.00mm
Color :
Black
Insulation Resistance :
1GOhm
Material - Insulation :
Polyamide (PA), Nylon, Glass Filled
Contact Finish :
Gold
Orientation :
Straight
Contact Material :
COPPER ALLOY
Card Thickness :
0.062 1.57mm
Read Out :
Dual
Current Rating :
1.1A
Contact Type :
Cantilever
Board Thickness :
1.56mm
Contact Plating :
Gold, Tin
Packaging :
Tray
Voltage - Rated AC :
300V
Feature :
Board Guide, Locking Ramp
Gender :
FEMALE
Number of Positions :
98
Termination :
Solder, Staggered
Contact Finish Thickness :
30.0μin 0.76μm
Connector Type :
Cantilever
Factory Lead Time :
11 Weeks
Card Type :
PCI Express™
Mounting Type :
Through Hole
Housing Color :
Black
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Housing Material :
Nylon
Number of Rows :
2
Datasheets
10108777-10002MLF
Introducing Edgeboard Connectors Amphenol Communications Solutions 10108777-10002MLF from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, 10108777-10002MLF pinout, 10108777-10002MLF datasheet PDF, 10108777-10002MLF amp .Beyond Edgeboard Connectors Amphenol Communications Solutions 10108777-10002MLF ,we also offer SM3ZS067U215AER1500, 1759547-1, 1-2199230-6, Our vast inventory has you covered. Contact us now for immediate solutions.



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