XC7Z030-3FBG484E
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- Mfr.Part #
- XC7Z030-3FBG484E
- Manufacturer
- AMD Xilinx
- Package / Case
- 484-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 1GHZ 484FCBGA
- Stock
- 3,661
- In Stock ：
- 3,661
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Data Bus Width :
- 32b
- Radiation Hardening :
- No
- Package / Case :
- 484-BBGA, FCBGA
- Terminal Pitch :
- 1mm
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Peak Reflow Temperature (Cel) :
- 250
- JESD-609 Code :
- e1
- HTS Code :
- 8542.39.00.01
- Terminal Form :
- Ball
- Number of Terminations :
- 484
- Supply Voltage-Max (Vsup) :
- 1.05V
- Published :
- 2009
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Boundary Scan :
- yes
- Height Seated (Max) :
- 2.54mm
- ECCN Code :
- EAR99
- Number of I/O :
- 130
- Packaging :
- Tray
- RoHS Status :
- ROHS3 Compliant
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Length :
- 23mm
- Operating Temperature :
- 0°C~100°C TJ
- Architecture :
- MCU, FPGA
- RAM (words) :
- 256000
- Number of Pins :
- 484
- Series :
- Zynq®-7000
- Frequency :
- 1GHz
- RAM Size :
- 256KB
- Speed Grade :
- -3
- Surface Mount :
- yes
- Base Part Number :
- XC7Z030
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Operating Supply Voltage :
- 1V
- Contact Plating :
- Copper, Silver, Tin
- Primary Attributes :
- Kintex™-7 FPGA, 125K Logic Cells
- Terminal Position :
- BOTTOM
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Supply Voltage :
- 1V
- Peripherals :
- DMA
- Core Architecture :
- ARM
- Factory Lead Time :
- 10 Weeks
- Datasheets
- XC7Z030-3FBG484E
484 Terminations 0°C~100°C TJ 484 Pin XC7Z030 System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) are used in the construction of this SoC.Manufacturer assigns package 484-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq®-7000 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex™-7 FPGA, 125K Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 130 I/Os.Use a power supply with a voltage of 1V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.05V.A system on a chip benefits from having 484 terminations.Searching XC7Z030 will bring up system on chips with similar specs and purposes.At 1GHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.The computer SoC is the 484-pin version.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-3FBG484E System On Chip (SoC) applications.
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
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