XC7Z010-3CLG225E
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- Mfr.Part #
- XC7Z010-3CLG225E
- Manufacturer
- AMD Xilinx
- Package / Case
- 225-LFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 866MHZ 225BGA
- Stock
- 41,688
- In Stock ：
- 41,688
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Terminal Position :
- BOTTOM
- Supply Voltage-Max (Vsup) :
- 1.05V
- HTS Code :
- 8542.39.00.01
- Number of Terminations :
- 225
- Supply Voltage :
- 1V
- RAM Size :
- 256KB
- Core Architecture :
- ARM
- Base Part Number :
- XC7Z010
- Published :
- 2010
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Boundary Scan :
- yes
- Terminal Pitch :
- 0.8mm
- Series :
- Zynq®-7000
- Frequency :
- 866MHz
- RoHS Status :
- ROHS3 Compliant
- Number of I/O :
- 86
- JESD-609 Code :
- e1
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- ECCN Code :
- EAR99
- Architecture :
- MCU, FPGA
- Peak Reflow Temperature (Cel) :
- 260
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Speed Grade :
- -3
- Factory Lead Time :
- 10 Weeks
- Operating Temperature :
- 0°C~100°C TJ
- Radiation Hardening :
- No
- RAM (words) :
- 256000
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Peripherals :
- DMA
- Data Bus Width :
- 32b
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Package / Case :
- 225-LFBGA, CSPBGA
- Supply Voltage-Min (Vsup) :
- 0.95V
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Primary Attributes :
- Artix™-7 FPGA, 28K Logic Cells
- Length :
- 13mm
- Terminal Form :
- Ball
- Surface Mount :
- yes
- Packaging :
- Tray
- Height Seated (Max) :
- 1.5mm
- Number of Pins :
- 225
- Datasheets
- XC7Z010-3CLG225E
225 Terminations 0°C~100°C TJ 225 Pin XC7Z010 System On Chip Zynq®-7000 Series 86 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) are used in the construction of this SoC.Manufacturer assigns package 225-LFBGA, CSPBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq®-7000 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.Taking note of the fact that this SoC security combines Artix™-7 FPGA, 28K Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 86 I/Os.Use a power supply with a voltage of 1V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.05V.Power supplies of at least 0.95V are required.A system on a chip benefits from having 225 terminations.Searching XC7Z010 will bring up system on chips with similar specs and purposes.At 866MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.The computer SoC is the 225-pin version.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z010-3CLG225E System On Chip (SoC) applications.
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
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