XC6SLX9-N3FTG256C
- Mfr.Part #
- XC6SLX9-N3FTG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 186 I/O 256FTBGA
- Stock
- 42,327
- In Stock :
- 42,327
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Qualification Status :
- Not Qualified
- Number of Pins :
- 256
- Operating Temperature :
- 0°C~85°C TJ
- JESD-609 Code :
- e1
- Clock Frequency :
- 806MHz
- HTS Code :
- 8542.39.00.01
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Combinatorial Delay of a CLB-Max :
- 0.26 ns
- RoHS Status :
- ROHS3 Compliant
- Number of Outputs :
- 186
- Number of CLBs :
- 715
- Series :
- Spartan®-6 LX
- Height Seated (Max) :
- 1.55mm
- Number of Terminations :
- 256
- RAM Size :
- 72kB
- Number of I/O :
- 186
- Base Part Number :
- XC6SLX9
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Operating Supply Voltage :
- 1.2V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Voltage - Supply :
- 1.14V~1.26V
- Width :
- 17mm
- Power Supplies :
- 1.21.2/3.32.5/3.3V
- Peak Reflow Temperature (Cel) :
- 260
- ECCN Code :
- EAR99
- Mounting Type :
- Surface Mount
- Number of Registers :
- 11440
- Mount :
- Surface Mount
- Total RAM Bits :
- 589824
- Length :
- 17mm
- Number of LABs/CLBs :
- 715
- Factory Lead Time :
- 10 Weeks
- Number of Logic Elements/Cells :
- 9152
- Terminal Position :
- BOTTOM
- Terminal Form :
- Ball
- Terminal Finish :
- TIN SILVER COPPER
- Terminal Pitch :
- 1mm
- Published :
- 2008
- Supply Voltage :
- 1.2V
- Package / Case :
- 256-LBGA
- Packaging :
- Tray
- Datasheets
- XC6SLX9-N3FTG256C

FPGAs AMD Xilinx XC6SLX9-N3FTG256C Overview
The FPGAs AMD Xilinx XC6SLX9-N3FTG256C is a highly capable FPGA from AMD Xilinx, designed for developers who need robust performance in digital processing and signal management. This integrated circuit features 186 I/O options packaged in a compact 256FTBGA form, making it an ideal choice for dense, high-speed applications. The XC6SLX9-N3FTG256C provides a versatile platform for designing and prototyping a wide range of electronic devices and systems, ensuring efficient processing with its advanced architecture. With its strong emphasis on reliability and adaptability, this FPGA caters to the needs of complex digital environments requiring high-throughput and minimal latency.
XC6SLX9-N3FTG256C Features
This particular model boasts a range of features that enhance its utility in various applications. Key attributes include its 186 input/output ports which facilitate extensive connectivity and integration capabilities. The device is encapsulated in a 256-pin fine-pitch ball grid array (FBGA) package, which supports dense, compact board designs. Additionally, the XC6SLX9-N3FTG256C is designed for scalable digital applications, offering flexibility in programming and deployment which is critical for rapid development cycles and updates.
XC6SLX9-N3FTG256C Applications
- Consumer Electronics: Used in devices such as gaming consoles and high-performance cameras, where rapid processing and high I/O bandwidth are critical for user experience and functionality.
- Automotive Systems: Implements advanced driver-assistance systems (ADAS) by processing multiple inputs from sensors and cameras, enhancing vehicle safety and performance.
- Industrial Automation: Serves as the core processing unit in automated machinery, controlling and executing operations with precision and reliability for improved productivity.
- Telecommunications: Facilitates data processing and signal management in network equipment, supporting high-speed communications and robust data handling.
- Medical Devices: Utilized in medical imaging systems, where accurate and fast processing of large datasets is essential for detailed imaging and diagnostics.
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