XC3S700A-5FGG400C
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- Mfr.Part #
- XC3S700A-5FGG400C
- Manufacturer
- AMD Xilinx
- Package / Case
- 400-BGA
- Datasheet
- Download
- Description
- IC FPGA 311 I/O 400FBGA
- Stock
- 247
- In Stock ：
- 247
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- RoHS Status :
- ROHS3 Compliant
- Operating Temperature :
- 0°C~85°C TJ
- Number of Pins :
- 400
- Number of LABs/CLBs :
- 1472
- Height Seated (Max) :
- 2.43mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Total RAM Bits :
- 368640
- Factory Lead Time :
- 10 Weeks
- Speed Grade :
- 5
- Mount :
- Surface Mount
- Supply Voltage :
- 1.2V
- Width :
- 21mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Pbfree Code :
- yes
- Clock Frequency :
- 770MHz
- RAM Size :
- 45kB
- Qualification Status :
- Not Qualified
- Voltage - Supply :
- 1.14V~1.26V
- JESD-609 Code :
- e1
- ECCN Code :
- 3A991.D
- Voltage :
- 3V
- Published :
- 1999
- Pin Count :
- 400
- Base Part Number :
- XC3S700A
- Terminal Form :
- Ball
- Length :
- 21mm
- Number of I/O :
- 311
- Number of Terminations :
- 400
- Combinatorial Delay of a CLB-Max :
- 0.62 ns
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Outputs :
- 248
- Operating Supply Voltage :
- 1.2V
- Series :
- Spartan®-3A
- Peak Reflow Temperature (Cel) :
- 250
- Number of Gates :
- 700000
- Packaging :
- Tray
- Package / Case :
- 400-BGA
- Terminal Position :
- BOTTOM
- Number of Logic Elements/Cells :
- 13248
- Terminal Pitch :
- 1mm
- Mounting Type :
- Surface Mount
- Datasheets
- XC3S700A-5FGG400C
FPGAs AMD Xilinx XC3S700A-5FGG400C Overview
The FPGAs AMD Xilinx XC3S700A-5FGG400C is a high-performance, field-programmable gate array that is ideal for a wide range of applications requiring rapid prototyping and production-scale deployment. This FPGA from AMD Xilinx stands out for its robust I/O capabilities and compact 400FBGA packaging, making it highly suitable for dense, space-constrained applications. With its advanced architecture, the XC3S700A-5FGG400C delivers exceptional performance and flexibility, allowing designers to customize the FPGA for their specific needs without committing to the high costs and extended development times associated with custom ASIC design.
XC3S700A-5FGG400C Features
The XC3S700A-5FGG400C FPGA features 311 I/O pins, enabling extensive interfacing with a variety of peripherals and other digital systems. Housed in a compact 400FBGA package, it provides a scalable solution for systems requiring a high degree of integration and performance. This FPGA is designed to support complex digital computations while maintaining a low power footprint, making it an efficient choice for advanced electronic systems.
XC3S700A-5FGG400C Applications
- Telecommunications: Utilized in communication infrastructure, the XC3S700A-5FGG400C helps in processing digital signals for both wired and wireless communication systems, enhancing bandwidth and reducing latency.
- Consumer Electronics: Integral in smart home devices, where it can manage multiple interfaces and support complex user interactions, while ensuring seamless operation and connectivity.
- Automotive: Deployed in automotive applications, this FPGA can control and process data from advanced driver-assistance systems (ADAS), contributing to safer and more intelligent vehicle functionalities.
- Industrial Automation: In industrial settings, the XC3S700A-5FGG400C drives the automation of machinery, improving precision and efficiency in production processes.
- Medical Devices: Essential for medical imaging systems, where it processes high-speed data and supports the critical demand for real-time, reliable imaging to aid in diagnostics.
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