XC3S400-4FTG256C
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- Mfr.Part #
- XC3S400-4FTG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 173 I/O 256FTBGA
- Stock
- 39,015
- In Stock ：
- 39,015
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Series :
- Spartan®-3
- Operating Supply Voltage :
- 1.2V
- Number of Pins :
- 256
- Terminal Position :
- BOTTOM
- Total RAM Bits :
- 294912
- Speed Grade :
- 4
- Pbfree Code :
- yes
- JESD-609 Code :
- e1
- Voltage - Supply :
- 1.14V~1.26V
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- ECCN Code :
- EAR99
- Height :
- 1mm
- RoHS Status :
- ROHS3 Compliant
- Width :
- 17mm
- Number of CLBs :
- 896
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Lead Free :
- Lead Free
- Supply Voltage :
- 1.2V
- Mounting Type :
- Surface Mount
- Packaging :
- Tray
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Gates :
- 400000
- Operating Temperature :
- 0°C~85°C TJ
- Number of Logic Elements/Cells :
- 8064
- Mount :
- Surface Mount
- Power Supplies :
- 1.21.2/3.32.5V
- Base Part Number :
- XC3S400
- Length :
- 17mm
- Published :
- 2009
- Terminal Form :
- Ball
- Package / Case :
- 256-LBGA
- Qualification Status :
- Not Qualified
- Clock Frequency :
- 630MHz
- Factory Lead Time :
- 10 Weeks
- Peak Reflow Temperature (Cel) :
- 260
- Number of LABs/CLBs :
- 896
- Number of Terminations :
- 256
- RAM Size :
- 36KB
- Number of Outputs :
- 173
- Pin Count :
- 256
- Number of I/O :
- 173
- Datasheets
- XC3S400-4FTG256C
FPGAs AMD Xilinx XC3S400-4FTG256C Overview
The AMD Xilinx XC3S400-4FTG256C FPGA is a high-performance, field-programmable gate array that delivers exceptional processing capabilities in a compact form factor. This versatile component is designed for developers requiring a robust platform for digital circuit development and applications demanding high-speed, reliable data processing. With 173 I/O pins encapsulated in a 256FTBGA package, it offers a flexible and scalable architecture that can accommodate a wide range of functionalities and complexities in system design.
XC3S400-4FTG256C Features
This FPGA model boasts several features that make it an excellent choice for a diverse array of technological needs. Key features include its ample I/O options, a 256-ball fine-pitch BGA (FTBGA) package that ensures a reduced footprint while maintaining high functionality, and support for numerous logic functions and memory configurations, which facilitate complex, integrated designs that require minimal additional components.
XC3S400-4FTG256C Applications
- Telecommunications Infrastructure: Utilized in routers and switchers for signal processing and data flow management, enhancing network efficiency and reliability.
- Consumer Electronics: Integral in the development of consumer electronics such as high-definition televisions and gaming consoles, providing support for sophisticated graphical processing and user interface functionalities.
- Automotive Systems: Employs in advanced driver-assistance systems (ADAS) where it processes multiple inputs from vehicle sensors to help with decision-making processes in real-time.
- Industrial Automation: Plays a critical role in robotic controls and machine vision systems, improving operational accuracy and speed in production lines.
- Medical Equipment: Applied in medical imaging systems, such as ultrasound and MRI machines, to handle complex signal processing tasks efficiently.
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