XA3S400-4FGG456I
- Mfr.Part #
- XA3S400-4FGG456I
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 264 I/O 456FBGA
- Stock
- 26,190
- In Stock :
- 26,190
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Form :
- Ball
- Qualification Status :
- Not Qualified
- Package / Case :
- 456-BBGA
- Height Seated (Max) :
- 2.6mm
- Factory Lead Time :
- 10 Weeks
- Peak Reflow Temperature (Cel) :
- 250
- Mount :
- Surface Mount
- Pin Count :
- 456
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Published :
- 2002
- JESD-609 Code :
- e1
- Number of Gates :
- 400000
- Speed Grade :
- 4
- Number of I/O :
- 264
- Number of CLBs :
- 896
- Number of Logic Elements/Cells :
- 8064
- Clock Frequency :
- 125MHz
- Supply Voltage :
- 1.2V
- Number of Terminations :
- 456
- Terminal Position :
- BOTTOM
- Number of Pins :
- 456
- Number of Outputs :
- 264
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Operating Temperature :
- -40°C~100°C TJ
- RAM Size :
- 36KB
- Length :
- 23mm
- ECCN Code :
- 3A991.D
- Voltage - Supply :
- 1.14V~1.26V
- RoHS Status :
- ROHS3 Compliant
- Base Part Number :
- XA3S400
- Power Supplies :
- 1.21.2/3.32.5V
- Width :
- 23mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Mounting Type :
- Surface Mount
- Total RAM Bits :
- 294912
- Operating Supply Voltage :
- 1.2V
- Number of LABs/CLBs :
- 896
- Series :
- Automotive, AEC-Q100, Spartan®-3 XA
- Packaging :
- Tray
- Terminal Pitch :
- 1mm
- Datasheets
- XA3S400-4FGG456I

FPGAs AMD Xilinx XA3S400-4FGG456I Overview
The AMD Xilinx XA3S400-4FGG456I is a highly capable FPGA (Field Programmable Gate Array) designed to meet the demanding needs of modern digital circuits. This advanced component features a 456-ball fine pitch BGA package that facilitates a robust and flexible pin-out structure necessary for complex designs. Ideal for designers looking for programmable logic solutions that require high-speed data processing and high I/O bandwidth, the XA3S400-4FGG456I is versatile enough to handle a wide range of applications, from consumer electronics to industrial systems. With its ability to be reprogrammed on the fly, this FPGA enables rapid prototyping and faster time-to-market, making it a preferred choice for innovative projects where flexibility and performance are paramount.
XA3S400-4FGG456I Features
This FPGA offers a comprehensive set of features including 264 I/O ports which provide ample connectivity for a variety of external devices. The chip's architecture is optimized for low power consumption and high-speed data processing, ensuring efficient performance even under rigorous operational conditions. Furthermore, the XA3S400-4FGG456I supports a wide range of design tools and software from AMD Xilinx, making it easier for engineers to implement, test, and deploy their applications.
XA3S400-4FGG456I Applications
- Telecommunications: Utilized in routers and switches, the XA3S400-4FGG456I enhances signal integrity and data flow management, enabling faster and more reliable network communications.
- Automotive Systems: Deployed in driver assistance systems, this FPGA processes real-time data from vehicle sensors to enhance safety features like collision detection and lane departure warnings.
- Consumer Electronics: Integral to devices such as high-definition televisions and gaming consoles, the FPGA improves image and sound processing capabilities for a better user experience.
- Industrial Automation: In factory automation systems, the XA3S400-4FGG456I streamlines operations by controlling machinery and processing sensory information, leading to enhanced productivity and reliability.
- Medical Devices: Used in medical imaging systems, the FPGA processes complex data sets to produce accurate and quick imaging results, crucial for diagnostic applications.
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