UPD70F3839GA-GAM-AX

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Mfr.Part #
UPD70F3839GA-GAM-AX
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
48-LQFP
Datasheet
Download
Description
IC MCU 32BIT 256KB FLASH 48LQFP
Stock
28,315
In Stock :
28,315

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Microcontrollers
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Data Bus Width :
32b
Frequency :
20MHz
Published :
2011
ROM (words) :
262144
Terminal Position :
QUAD
Surface Mount :
yes
Memory Size :
256KB
DMA Channels :
No
Length :
7mm
Supply Current-Max :
20mA
Supply Voltage :
3V
RoHS Status :
ROHS3 Compliant
Connectivity :
CSI, EBI/EMI, I2C, UART/USART
Program Memory Size :
256KB 256K x 8
Program Memory Type :
Flash
Oscillator Type :
Internal
RAM Size :
16K x 8
Package / Case :
48-LQFP
Supply Voltage-Max (Vsup) :
5.5V
Number of Terminations :
48
Operating Supply Voltage :
3.3V
Number of I/O :
34
Interface :
EBI/EMI, I2C, UART, USART
Pbfree Code :
yes
Base Part Number :
UPD70F3839
Series :
V850ES/Jx3-L
Terminal Form :
Gull wing
REACH SVHC :
No SVHC
Has ADC :
yes
Watchdog Timer :
yes
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Mounting Type :
Surface Mount
Voltage - Supply (Vcc/Vdd) :
2.2V~3.6V
Number of Pins :
48
Core Size :
32-Bit
Pin Count :
48
Terminal Pitch :
0.5mm
Number of Timers/Counters :
9
Peripherals :
DMA, LVD, PWM, WDT
Bit Size :
32
Packaging :
Tray
Number of UART Channels :
3
Factory Lead Time :
24 Weeks
Operating Temperature :
-40°C~85°C TA
Radiation Hardening :
No
Data Converter :
A/D 6x10b; D/A 1x8b
PWM Channels :
yes
Core Processor :
V850ES
Introducing Microcontrollers Intersil (Renesas Electronics Corporation) UPD70F3839GA-GAM-AX from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:48-LQFP, Number of Terminations:48, Base Part Number:UPD70F3839, Mounting Type:Surface Mount, Number of Pins:48, Operating Temperature:-40°C~85°C TA, UPD70F3839GA-GAM-AX pinout, UPD70F3839GA-GAM-AX datasheet PDF, UPD70F3839GA-GAM-AX amp .Beyond Microcontrollers Intersil (Renesas Electronics Corporation) UPD70F3839GA-GAM-AX ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) UPD70F3839GA-GAM-AX


Microcontrollers Intersil (Renesas Electronics Corporation) UPD70F3839GA-GAM-AX Overview

The Microcontrollers Intersil (Renesas Electronics Corporation) UPD70F3839GA-GAM-AX is a high-performance 32-bit microcontroller equipped with 256KB of flash memory, housed in a compact 48LQFP package. This microcontroller is designed to offer robust processing capabilities with a flexible memory architecture, making it suitable for a variety of demanding applications. Its advanced technology ensures efficient power management and reliable operation, crucial for developers looking to integrate a powerful MCU into their systems. The integration of advanced features in this microcontroller supports enhanced system control, improved data security, and increased operational efficiency, making it a top choice for engineers and developers aiming to optimize their embedded systems.

UPD70F3839GA-GAM-AX Features

  • 32-bit MCU architecture for advanced processing power.
  • 256KB of integrated FLASH memory, enabling complex applications and software to run smoothly.
  • Compact 48LQFP package allows for efficient use of PCB space.
  • Highly efficient power management capabilities to ensure minimal energy consumption.
  • Robust security features to protect against data breaches and ensure system integrity.

UPD70F3839GA-GAM-AX Applications

  • Automotive Control Systems: This MCU can be implemented in engine management systems and other vehicle monitoring systems to enhance performance and reliability.
  • Industrial Automation: Ideal for use in manufacturing robots, assembly line controllers, and other automation equipment, the UPD70F3839GA-GAM-AX provides precise control and improved operational efficiency.
  • Smart Home Devices: It powers various smart devices within home automation, including security systems and HVAC controllers, offering enhanced connectivity and smarter energy management.
  • Healthcare Equipment: Utilized in medical monitoring systems and diagnostic equipment to ensure rapid data processing and reliable operation in critical healthcare applications.
  • Telecommunication Infrastructure: Supports telecommunications systems with its robust processing capabilities to manage data flow and system operations effectively.
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