TSM-110-04-S-DV-P
- Mfr.Part #
- TSM-110-04-S-DV-P
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 20POS 2.54MM
- Stock
- 12,668
- In Stock :
- 12,668
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Material Flammability Rating :
- UL94 V-0
- MIL Conformance :
- No
- Mixed Contacts :
- No
- Contact Finish - Mating :
- Gold
- Insulation Color :
- Black
- DIN Conformance :
- No
- Mounting Option 1 :
- LOCKING
- Insulation Height :
- 0.100 2.54mm
- Number of Rows :
- 2
- Contact Type :
- Male Pin
- Contact Length - Mating :
- 0.120 3.05mm
- Row Spacing - Mating :
- 0.100 (2.54mm)
- JESD-609 Code :
- e3
- Body Length or Diameter :
- 1 inch
- Mating Contact Pitch :
- 0.1 inch
- Feature :
- Pick and Place
- Number of Positions :
- 20
- Additional Feature :
- E.L.P.
- Termination :
- Solder
- Fastening Type :
- Push-Pull
- Connector Type :
- Header
- Option :
- GENERAL PURPOSE
- ECCN Code :
- EAR99
- Contact Material :
- Phosphor Bronze
- Series :
- TSM
- HTS Code :
- 8536.69.40.40
- Pitch - Mating :
- 0.100 2.54mm
- PCB Contact Pattern :
- RECTANGULAR
- Reliability :
- COMMERCIAL
- Filter Feature :
- No
- Contact Finish - Post :
- Tin
- Contact Shape :
- Square
- Pbfree Code :
- yes
- Shrouding :
- Unshrouded
- Contact Finish Thickness - Mating :
- 30.0μin 0.76μm
- Reference Standard :
- UL
- Mounting Type :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- Number of Conductors :
- ONE
- Operating Temperature :
- -55°C~125°C
- Number Of PCB Rows :
- 2
- Lead Free :
- Lead Free
- Plating Thickness :
- 30μin
- IEC Conformance :
- No
- Packaging :
- Tube
- Total Number of Contacts :
- 20
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Number of Positions Loaded :
- All
- Style :
- Board to Board or Cable
- Datasheets
- TSM-110-04-S-DV-P

TSM Series 2-Row Header Solder Phosphor Bronze Tube Surface Mount Gold Liquid Crystal Polymer (LCP) 20-Position Board to Board or Cable 0.100 2.54mm Height
TSM-110-04-S-DV-P Overview
A Header package is included with it.Its mounting type is Surface Mount.Packaging is performed using a Tube case.It is part of the TSM Series of products.Additionally, there are other features, such as E.L.P..A number of features make it more powerful because of its Pick and Place feature.There is no operating temperature for the device.
TSM-110-04-S-DV-P Features
TSM series
TSM-110-04-S-DV-P Applications
There are a lot of Samtec Inc.
TSM-110-04-S-DV-P Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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