THGBMHG9C8LBAWG

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Mfr.Part #
THGBMHG9C8LBAWG
Manufacturer
Kioxia America, Inc.
Package / Case
Datasheet
Download
Description
IC FLASH 512GBIT EMMC 153WFBGA
Stock
22,169
In Stock :
22,169

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Manufacturer :
Kioxia America, Inc.
Product Category :
Memory
Pbfree Code :
yes
JESD-30 Code :
R-PBGA-B153
Number of Terminations :
153
Operating Temperature (Min) :
-40°C
Terminal Position :
BOTTOM
RoHS Status :
Non-RoHS Compliant
Organization :
64GX8
Memory Density :
549755813888 bit
Memory IC Type :
MEMORY CIRCUIT
Published :
2016
Terminal Form :
Ball
Operating Mode :
ASYNCHRONOUS
Operating Temperature (Max) :
85°C
Memory Width :
8
Number of Functions :
1
Temperature Grade :
Industrial
Surface Mount :
yes
Datasheets
THGBMHG9C8LBAWG
Introducing Memory Kioxia America, Inc. THGBMHG9C8LBAWG from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:153, THGBMHG9C8LBAWG pinout, THGBMHG9C8LBAWG datasheet PDF, THGBMHG9C8LBAWG amp .Beyond Memory Kioxia America, Inc. THGBMHG9C8LBAWG ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Kioxia America, Inc. THGBMHG9C8LBAWG


Memory Kioxia America, Inc. THGBMHG9C8LBAWG Overview

Introducing the Memory Kioxia America, Inc. THGBMHG9C8LBAWG, a high-capacity 512 Gbit eMMC flash memory designed for high-performance and energy-efficient applications in a broad range of digital environments. Manufactured by Kioxia America, Inc., this IC FLASH memory is housed in a compact 153WFBGA package, ensuring robust data integrity and speed in a minimal footprint. Ideal for manufacturers seeking dependable storage solutions, this product offers unmatched reliability and advanced technology for intensive applications.

THGBMHG9C8LBAWG Features

The THGBMHG9C8LBAWG IC FLASH incorporates several key features that distinguish it from competitors:

  • High Storage Capacity: 512 Gbit of storage, enabling substantial data management and retention capabilities.
  • Efficient Packaging: The 153WFBGA package is optimized for space-constrained applications, providing high-density memory integration without sacrificing performance.
  • Durability: Engineered for resilience, capable of withstanding rigorous conditions while maintaining operational integrity.
  • Energy Efficiency: Designed to reduce power consumption, making it suitable for devices where battery life is critical.

THGBMHG9C8LBAWG Applications

  • Smartphones: Integrates seamlessly into mobile technology, providing substantial memory for OS, apps, and user data, enhancing overall device performance and user experience.
  • Tablets: Empowers tablet devices with the capability to handle intensive multimedia applications and large-scale data storage without compromising on speed or reliability.
  • Digital Cameras: Ideal for high-resolution image and video storage, enabling fast processing and reliable saving of large multimedia files.
  • Automotive Systems: Can be used in advanced driver-assistance systems (ADAS) where robust and reliable data storage is crucial for functionality and safety.
  • Wearable Technology: Perfect for wearables, providing the necessary data handling capacity in a compact form factor, supporting advanced applications like health monitoring and mobile connectivity.
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Shipping Method

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Shipping Cost

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