SVF322R3K1CKU2

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Format :

Floating Point

RAM Controllers :

LPDDR2, DDR3, DRAM

JESD-609 Code :

e3

HTS Code :

8542.31.00.01

Security Features :

ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG

Number of Cores/Bus Width :

2 Core 32-Bit

Low Power Mode :

yes

Surface Mount :

yes

USB :

USB 2.0 OTG + PHY (1)

Additional Interfaces :

CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART

RoHS Status :

ROHS3 Compliant

Display & Interface Controllers :

DCU, GPU, LCD, VideoADC, VIU

Integrated Cache :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Ethernet :

10/100Mbps (2)

Terminal Pitch :

0.5mm

Co-Processors/DSP :

Multimedia; NEON™ MPE

Supply Voltage :

3.3V

ECCN Code :

5A002.A.1

Voltage - I/O :

3.3V

Graphics Acceleration :

yes

Packaging :

Bulk

Terminal Position :

QUAD

Peak Reflow Temperature (Cel) :

260

JESD-30 Code :

S-PQFP-G176

Length :

24mm

Supply Voltage-Min (Vsup) :

3V

Height Seated (Max) :

1.6mm

Number of Terminations :

176

Series :

Vybrid, VF3xxR

Terminal Finish :

Matte Tin (Sn)

Core Processor :

ARM® Cortex®-A5 + Cortex®-M4

Factory Lead Time :

15 Weeks

Operating Temperature :

-40°C~85°C TA

Published :

2014

Supply Voltage-Max (Vsup) :

3.6V

Boundary Scan :

yes

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Terminal Form :

Gull wing

Speed :

266MHz, 133MHz

Package / Case :

176-LQFP Exposed Pad

Base Part Number :

SVF322

Time@Peak Reflow Temperature-Max (s) :

40