SN74LVC125APWG4

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Mfr.Part #
SN74LVC125APWG4
Manufacturer
Texas Instruments
Package / Case
14-TSSOP (0.173, 4.40mm Width)
Datasheet
Download
Description
IC BUF NON-INVERT 3.6V 14TSSOP
Stock
2,431
In Stock :
2,431

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Manufacturer :
Texas Instruments
Product Category :
Buffers, Drivers, Receivers, Transceivers
Quiescent Current :
1μA
Logic Function :
Buffer, Inverting
Terminal Form :
Gull wing
Package / Case :
14-TSSOP (0.173, 4.40mm Width)
Mounting Type :
Surface Mount
Number of Terminations :
14
ECCN Code :
EAR99
Height :
1.2mm
Voltage - Supply :
1.65V~3.6V
Pin Count :
14
Width :
4.4mm
Lifecycle Status :
ACTIVE (Last Updated: 1 week ago)
Lead Free :
Lead Free
REACH SVHC :
No SVHC
Max Power Dissipation :
500mW
Number of Ports :
2
Radiation Hardening :
No
Polarity :
Non-Inverting
Number of Channels :
4
JESD-609 Code :
e4
Number of Pins :
14
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Family :
LVC/LCX/Z
Control Type :
ENABLE LOW
Base Part Number :
74LVC125
Logic Type :
Buffer, Non-Inverting
Current - Output High, Low :
24mA 24mA
Mount :
Surface Mount
Load Capacitance :
50pF
Operating Temperature :
-40°C~125°C TA
Number of Functions :
4
Peak Reflow Temperature (Cel) :
260
Number of Output Lines :
3
Terminal Position :
Dual
Packaging :
Tube
Length :
5mm
Number of Bits per Element :
1
Thickness :
1mm
Terminal Finish :
Nickel/Palladium/Gold (Ni/Pd/Au)
Output Type :
3-STATE
Series :
74LVC
Supply Voltage :
1.8V
RoHS Status :
ROHS3 Compliant
Pbfree Code :
yes
Propagation Delay :
4.6 ns
Factory Lead Time :
6 Weeks
Turn On Delay Time :
5.3 ns
Count Direction :
Unidirectional
Datasheets
SN74LVC125APWG4
Introducing Buffers, Drivers, Receivers, Transceivers Texas Instruments SN74LVC125APWG4 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:14-TSSOP (0.173, 4.40mm Width), Mounting Type:Surface Mount, Number of Terminations:14, Number of Channels:4, Number of Pins:14, Base Part Number:74LVC125, Operating Temperature:-40°C~125°C TA, SN74LVC125APWG4 pinout, SN74LVC125APWG4 datasheet PDF, SN74LVC125APWG4 amp .Beyond Buffers, Drivers, Receivers, Transceivers Texas Instruments SN74LVC125APWG4 ,we also offer SN74LVC244APWR, SN74AUP1G07DCKR, SN74LVC2G125DCUR, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments SN74LVC125APWG4


Buffers, Drivers, Receivers, Transceivers Texas Instruments SN74LVC125APWG4 Overview

The Texas Instruments SN74LVC125APWG4 is a state-of-the-art buffer and line driver designed for 2 V to 3.6 V VCC operation, housed in a compact 14-TSSOP package. This device epitomizes reliability and precision, making it an ideal choice for managing high-speed signals in digital communication systems. Each unit contains four independent non-inverting buffers with 3-state outputs, which can be used to drive terminated lines with low output impedance, or to isolate bus lines to prevent signal conflict. The integration of this component in your hardware setup ensures stable functionality and high signal integrity, key for achieving optimal performance in high-demand applications.

SN74LVC125APWG4 Features

Features of the SN74LVC125APWG4 include four independent non-inverting buffers, each equipped with its own 3-state output for bus line driving or isolation. The device supports a wide range of supply voltages from 2 V to 3.6 V, enabling it to be used in various operating environments. Moreover, the device's low power consumption and high-speed data handling capabilities make it an efficient choice for sophisticated electronic circuits.

SN74LVC125APWG4 Applications

  • Microprocessor Systems: Utilized to interface transceivers with microprocessors, ensuring signal integrity and reducing loading.
  • Portable Devices: Helps manage power consumption efficiently in battery-operated devices by providing stable outputs even at low voltages.
  • Data Communication: Essential for data transmission applications, ensuring clear signal transition without distortion across various communication mediums.
  • Server Applications: Used in server motherboards to enhance signal integrity between different chipset components under variable electronic conditions.
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