S9S12DG12F1CPVE

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

DMA Channels :

yes

Peripherals :

PWM, WDT

Oscillator Type :

Internal

JESD-609 Code :

e3

Time@Peak Reflow Temperature-Max (s) :

40

RoHS Status :

ROHS3 Compliant

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Number of Terminations :

112

Peak Reflow Temperature (Cel) :

260

Number of I/O :

91

RAM Size :

8K x 8

Package / Case :

112-LQFP

Program Memory Type :

Flash

Operating Temperature :

-40°C~85°C TA

JESD-30 Code :

S-PQFP-G112

Core Size :

16-Bit

Published :

1996

Surface Mount :

yes

EEPROM Size :

2K x 8

DAC Channels :

No

Terminal Form :

Gull wing

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Width :

20mm

Series :

HCS12

Terminal Pitch :

0.65mm

Packaging :

Tray

Length :

20mm

Speed :

25MHz

Factory Lead Time :

13 Weeks

Data Converter :

A/D 16x10b

PWM Channels :

yes

Height Seated (Max) :

1.6mm

Supply Voltage-Min (Vsup) :

1.72V

Voltage - Supply (Vcc/Vdd) :

2.35V~5.25V

Supply Voltage :

1.8V

Bit Size :

16

Terminal Position :

QUAD

Terminal Finish :

Tin (Sn)

HTS Code :

8542.31.00.01

Supply Voltage-Max (Vsup) :

1.98V

Has ADC :

yes

Mounting Type :

Surface Mount

Program Memory Size :

128KB 128K x 8