S29GL256P11FFIV23

Manufacturer :

Infineon Technologies

Product Category :

Memory

Mount :

Surface Mount

Terminal Pitch :

1mm

Memory Type :

Non-Volatile

Peak Reflow Temperature (Cel) :

260

Power Supplies :

1.8/3.33/3.3V

Memory Interface :

Parallel

Time@Peak Reflow Temperature-Max (s) :

40

JESD-609 Code :

e1

Memory Format :

Flash

Toggle Bit :

yes

ECCN Code :

3A991.B.1.A

Data Bus Width :

8B

Voltage - Supply :

1.65V~3.6V

Supply Voltage-Max (Vsup) :

3.6V

Density :

256 Mb

Alternate Memory Width :

8

Organization :

256MX1

RoHS Status :

ROHS3 Compliant

Memory Size :

256Mb 32M x 8

Command User Interface :

yes

Operating Temperature :

-40°C~85°C TA

Mounting Type :

Surface Mount

Nominal Supply Current :

110mA

Common Flash Interface :

yes

Write Cycle Time - Word, Page :

110ns

Sync/Async :

ASYNCHRONOUS

Series :

GL-P

HTS Code :

8542.32.00.51

Standby Current-Max :

0.000005A

Data Polling :

yes

Number of Pins :

64

Page Size :

8/16words

Published :

2017

Access Time (Max) :

110 ns

Packaging :

Tape and Reel (TR)

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Sector Size :

128K

Ready/Busy :

yes

Programming Voltage :

3V

Package / Case :

64-LBGA

Memory Width :

1

Number of Sectors/Size :

256

Supply Voltage :

3V

Number of Terminations :

64

Terminal Position :

BOTTOM

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Length :

13mm

Number of Functions :

1

Height Seated (Max) :

1.4mm

Supply Voltage-Min (Vsup) :

2.7V

Factory Lead Time :

16 Weeks

Radiation Hardening :

No