MT47H64M8SH-25E AIT:H TR

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Mfr.Part #
MT47H64M8SH-25E AIT:H TR
Manufacturer
Micron Technology
Package / Case
60-TFBGA
Datasheet
Download
Description
IC DRAM 512MBIT PARALLEL 60FBGA
Stock
5,724
In Stock :
5,724

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Manufacturer :
Micron Technology
Product Category :
Memory
Voltage - Supply :
1.7V~1.9V
Factory Lead Time :
12 Weeks
Memory Interface :
Parallel
Packaging :
Tape and Reel (TR)
Base Part Number :
MT47H64M8
Memory Type :
Volatile
Access Time :
400ps
Memory Format :
DRAM
Operating Temperature :
-40°C~95°C TC
Write Cycle Time - Word, Page :
15ns
Memory Size :
512Mb 64M x 8
RoHS Status :
ROHS3 Compliant
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Package / Case :
60-TFBGA
Clock Frequency :
400MHz
Mounting Type :
Surface Mount
Introducing Memory Micron Technology MT47H64M8SH-25E AIT:H TR from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:MT47H64M8, Operating Temperature:-40°C~95°C TC, Package / Case:60-TFBGA, Mounting Type:Surface Mount, MT47H64M8SH-25E AIT:H TR pinout, MT47H64M8SH-25E AIT:H TR datasheet PDF, MT47H64M8SH-25E AIT:H TR amp .Beyond Memory Micron Technology MT47H64M8SH-25E AIT:H TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT47H64M8SH-25E AIT:H TR


Memory Micron Technology MT47H64M8SH-25E AIT:H TR Overview

The Memory Micron Technology MT47H64M8SH-25E AIT:H TR represents a sophisticated integration of density, performance, and reliability for enterprise-level solutions. Engineered by Micron Technology, this DRAM IC features a substantial 512Mbit capacity and utilizes a parallel interface encapsulated in a compact 60FBGA package. This product is designed to meet the rigorous demands of advanced computing systems, offering high-speed data transfer and low-power operation, which makes it ideal for high-performance applications needing robust memory solutions.

MT47H64M8SH-25E AIT:H TR Features

The MT47H64M8SH-25E AIT:H TR includes several key features that make it an attractive option for technology solutions requiring high-capacity memory. It operates with a high-speed data interface, ensuring efficient processing speeds for demanding applications. The 60FBGA packaging is not only space-efficient but also offers enhanced thermal characteristics, which improve the overall reliability and longevity of the component. Moreover, the parallel architecture facilitates faster access times, which is crucial for performance-critical applications.

MT47H64M8SH-25E AIT:H TR Applications

  • Advanced Computing Systems: Ideal for use in servers and high-performance computing systems where large volumes of data need to be processed quickly and efficiently.
  • Networking Equipment: Applies to high-speed network routers and switches, where memory bandwidth and capacity are critical for maintaining high throughput and low latency.
  • Telecommunications: Used in telecommunications infrastructure, supporting the demands of high-speed data transmission and signal processing.
  • Gaming Consoles: Suitable for gaming consoles, enhancing the gaming experience by allowing for faster load times and smoother gameplay due to its high data throughput capabilities.
  • Embedded Systems: Perfect for embedded applications, providing robust memory capacity within a compact form factor for industrial and automotive applications.
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Shipping Cost

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