M2S090-FCS325
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- Mfr.Part #
- M2S090-FCS325
- Manufacturer
- Microchip Technology
- Package / Case
- 325-TFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 325BGA
- Stock
- 3,762
- In Stock ：
- 3,762
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- JESD-609 Code :
- e0
- Primary Attributes :
- FPGA - 90K Logic Modules
- Power Supplies :
- 1.2V
- Terminal Pitch :
- 0.5mm
- Flash Size :
- 512kB
- Packaging :
- Tray
- Surface Mount :
- yes
- Number of Logic Cells :
- 86316
- Peripherals :
- DDR, PCIe, SERDES
- RoHS Status :
- Non-RoHS Compliant
- Width :
- 11mm
- JESD-30 Code :
- R-PBGA-B325
- Published :
- 2015
- Terminal Form :
- Ball
- Supply Voltage-Max (Vsup) :
- 1.26V
- Number of Inputs :
- 180
- Series :
- SmartFusion®2
- Terminal Position :
- BOTTOM
- Supply Voltage-Min (Vsup) :
- 1.14V
- Number of I/O :
- 180
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Speed :
- 166MHz
- HTS Code :
- 8542.39.00.01
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Reach Compliance Code :
- not_compliant
- Number of Terminations :
- 325
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Operating Temperature :
- 0°C~85°C TJ
- Height Seated (Max) :
- 1.16mm
- Qualification Status :
- Not Qualified
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Package / Case :
- 325-TFBGA, CSPBGA
- Number of Outputs :
- 180
- Factory Lead Time :
- 12 Weeks
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RAM Size :
- 64KB
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 3 weeks ago)
- Supply Voltage :
- 1.2V
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Core Processor :
- ARM® Cortex®-M3
- Length :
- 13.5mm
- Additional Feature :
- LG-MIN, WD-MIN
- Architecture :
- MCU, FPGA
- Datasheets
- M2S090-FCS325
325 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 180 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 325-TFBGA, CSPBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion®2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 90K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 180 inputs and outputs.Ideally, a power supply with a voltage of 1.2V should be used.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 1.14V, it should be able to function.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 325 terminations.This SoC chip is capable of having 180 outputs, which is convenient.There is 1.2V power supply requirement for this system on chip SoC.The SoC chip offers 180 inputs.System on chips of logic are comprised of 86316 logic cells.This flash has a size of 512KB.Aside from that, this SoC processor is also equipped with some additional features that are present in LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S090-FCS325 System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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