M2S060-FCS325I
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- Mfr.Part #
- M2S060-FCS325I
- Manufacturer
- Microchip Technology
- Package / Case
- 325-TFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 325BGA
- Stock
- 17,522
- In Stock ：
- 17,522
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Width :
- 11mm
- Number of Logic Cells :
- 56520
- Core Processor :
- ARM® Cortex®-M3
- RoHS Status :
- Non-RoHS Compliant
- Supply Voltage-Max (Vsup) :
- 1.26V
- Terminal Form :
- Ball
- Terminal Pitch :
- 0.5mm
- Additional Feature :
- LG-MIN, WD-MIN
- Length :
- 11mm
- Number of Terminations :
- 325
- Speed :
- 166MHz
- JESD-609 Code :
- e0
- RAM Size :
- 64KB
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Flash Size :
- 256KB
- Architecture :
- MCU, FPGA
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- HTS Code :
- 8542.39.00.01
- Height Seated (Max) :
- 1.01mm
- Surface Mount :
- yes
- Terminal Position :
- BOTTOM
- Factory Lead Time :
- 8 Weeks
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of I/O :
- 200
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Packaging :
- Tray
- Published :
- 2015
- Primary Attributes :
- FPGA - 60K Logic Modules
- Package / Case :
- 325-TFBGA, CSPBGA
- Operating Supply Voltage :
- 1.2V
- Peripherals :
- DDR, PCIe, SERDES
- Supply Voltage :
- 1.2V
- Reach Compliance Code :
- not_compliant
- Number of Pins :
- 325
- Number of Outputs :
- 200
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 2 weeks ago)
- Qualification Status :
- Not Qualified
- Series :
- SmartFusion®2
- Operating Temperature :
- -40°C~100°C TJ
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Datasheets
- M2S060-FCS325I
325 Terminations -40°C~100°C TJ 325 Pin System On Chip SmartFusion®2 Series 200 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
A ARM® Cortex®-M3 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 325-TFBGA, CSPBGA package.With 64KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion®2 series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 60K Logic Modules.Housed in the state-of-art Tray package.200 I/Os in total are included in this SoC part.It is advised to utilize a 1.2V power supply.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.There are 325 terminations in total and that really benefits system on a chip.You can have 200 user outputs for this SoC chip.Logic system on chips features 56520 logic cells.It has a 256KB flash.Additionally, this SoC processor features LG-MIN, WD-MIN.This is the 325-pin version of the computer SoC.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S060-FCS325I System On Chip (SoC) applications.
- Automotive gateway
- Body control module
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
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