M2S050-FGG484I
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- Mfr.Part #
- M2S050-FGG484I
- Manufacturer
- Microchip Technology
- Package / Case
- 484-BGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 484FBGA
- Stock
- 49,306
- In Stock ：
- 49,306
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- JESD-609 Code :
- e3
- Terminal Pitch :
- 1mm
- Height Seated (Max) :
- 2.44mm
- RoHS Status :
- RoHS Compliant
- Speed :
- 166MHz
- Packaging :
- Tray
- Number of I/O :
- 267
- Length :
- 23mm
- Factory Lead Time :
- 4 Weeks
- Number of Terminations :
- 484
- Core Processor :
- ARM® Cortex®-M3
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Series :
- SmartFusion®2
- Width :
- 23mm
- Supply Voltage-Max (Vsup) :
- 1.26V
- Supply Voltage-Min (Vsup) :
- 1.14V
- Surface Mount :
- yes
- Primary Attributes :
- FPGA - 50K Logic Modules
- Qualification Status :
- Not Qualified
- HTS Code :
- 8542.39.00.01
- Terminal Form :
- Ball
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Operating Temperature :
- -40°C~100°C TJ
- Number of Inputs :
- 267
- Architecture :
- MCU, FPGA
- Package / Case :
- 484-BGA
- Peripherals :
- DDR, PCIe, SERDES
- Supply Voltage :
- 1.2V
- Power Supplies :
- 1.2V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Outputs :
- 267
- Terminal Position :
- BOTTOM
- Number of Logic Cells :
- 56340
- Flash Size :
- 256KB
- JESD-30 Code :
- S-PBGA-B484
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Published :
- 2014
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 1 month ago)
- RAM Size :
- 64KB
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Finish :
- MATTE TIN
- Datasheets
- M2S050-FGG484I
484 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 267 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 484-BGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion®2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 50K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 267 inputs and outputs.Ideally, a power supply with a voltage of 1.2V should be used.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 1.14V, it should be able to function.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 484 terminations.This SoC chip is capable of having 267 outputs, which is convenient.There is 1.2V power supply requirement for this system on chip SoC.The SoC chip offers 267 inputs.System on chips of logic are comprised of 56340 logic cells.This flash has a size of 256KB.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S050-FGG484I System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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