LFX125EB-04FN256I
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- Mfr.Part #
- LFX125EB-04FN256I
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 160 I/O 256FBGA
- Stock
- 33,965
- In Stock ：
- 33,965
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Packaging :
- Tray
- Operating Supply Voltage :
- 2.5V
- Length :
- 17mm
- Number of Terminations :
- 256
- Lead Free :
- Lead Free
- Number of I/O :
- 160
- Package / Case :
- 256-BGA
- Published :
- 2000
- JESD-609 Code :
- e1
- Terminal Form :
- Ball
- Height Seated (Max) :
- 2.1mm
- Mount :
- Surface Mount
- Voltage - Supply :
- 2.3V~3.6V
- RAM Size :
- 11.5kB
- Combinatorial Delay of a CLB-Max :
- 0.93 ns
- RoHS Status :
- RoHS Compliant
- Pbfree Code :
- yes
- Number of Outputs :
- 160
- Series :
- ispXPGA®
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Operating Temperature :
- -40°C~105°C TJ
- Pin Count :
- 256
- Mounting Type :
- Surface Mount
- Base Part Number :
- LFX125
- Additional Feature :
- ALSO OPERATES WITH 3.3V SUPPLY
- Supply Voltage :
- 2.5V
- Terminal Position :
- BOTTOM
- ECCN Code :
- EAR99
- Number of Gates :
- 139000
- Number of Pins :
- 256
- Terminal Pitch :
- 1mm
- Peak Reflow Temperature (Cel) :
- 250
- Power Supplies :
- 2.5/3.3V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Size :
- 15.3kB
- Number of CLBs :
- 484
- HTS Code :
- 8542.39.00.01
- Width :
- 17mm
- Radiation Hardening :
- No
- Number of Logic Elements/Cells :
- 1936
- Total RAM Bits :
- 94208
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Datasheets
- LFX125EB-04FN256I
FPGAs Lattice Semiconductor LFX125EB-04FN256I Overview
The LFX125EB-04FN256I from Lattice Semiconductor is a high-performance Field Programmable Gate Array (FPGA) that offers a flexible solution for a multitude of advanced electronic applications. This FPGA is designed to deliver high-speed performance and high-density integration to meet the demanding requirements of modern technology systems. With its 256FBGA package, it provides a compact form factor that is ideal for space-constrained applications, while its 160 I/O pins enable extensive connectivity and interface options. Utilizing the robust capabilities of the FPGAs Lattice Semiconductor LFX125EB-04FN256I can significantly enhance system efficiency and functionality, making it an invaluable component in the design and deployment of cutting-edge electronic solutions.
LFX125EB-04FN256I Features
The LFX125EB-04FN256I FPGA is equipped with several key features that make it a top choice for developers and engineers. These include its 256-ball Fine Pitch Ball Grid Array (FBGA) packaging that ensures a reduced footprint on system boards, and 160 input/output pins for versatile connections. The device is built to support complex digital computations while maintaining a low power consumption, making it suitable for energy-sensitive projects. Its high reliability and adaptability to multiple environments underscore its suitability for rigorous industrial applications.
LFX125EB-04FN256I Applications
- Telecommunications: Utilized in network infrastructure to manage signal processing and data flow efficiently.
- Consumer Electronics: Deployed in devices such as smartphones, tablets, and gaming consoles to enhance processing capabilities and multimedia functionalities.
- Automotive: Integral in advanced driver-assistance systems (ADAS) for processing and sensor integration.
- Industrial: Used in control systems for automation and process management, ensuring high-speed operations and reliability.
- Medical Devices: Employs in medical imaging systems and diagnostic equipment for fast and accurate data processing.
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