GS8182D18BGD-300I

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Mfr.Part #
GS8182D18BGD-300I
Manufacturer
GSI Technology
Package / Case
BGA-165
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FPBGA
Stock
18,686
In Stock :
18,686

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Manufacturer :
GSI Technology
Product Category :
Memory
Operating Mode :
SYNCHRONOUS
HTS Code :
8542.32.00.41
Memory Interface :
Parallel
Number of Words :
1048576 words
Seated Height-Max :
1.4 mm
Package Shape :
RECTANGULAR
Product Status :
Active
Memory Width :
18
Length :
15 mm
Organization :
1 M x 18
Mounting Style :
SMD/SMT
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Qualification Status :
Not Qualified
Terminal Form :
Ball
ECCN Code :
3A991.B.2.B
Subcategory :
Memory and Data Storage
Surface Mount :
yes
Factory Lead Time :
8 Weeks
Minimum Operating Temperature :
- 40 C
Number of Terminals :
165
Peak Reflow Temperature (Cel) :
260
Manufacturer :
GSI Technology
JESD-609 Code :
e1
Terminal Position :
BOTTOM
Number of Functions :
1
Memory IC Type :
DDR SRAM
Product Type :
SRAM
Supplier Device Package :
165-FPBGA (15x13)
Interface Type :
Parallel
Voltage - Supply :
1.7V ~ 1.9V
Memory Density :
18874368 bit
Supply Voltage-Min (Vsup) :
1.7 V
Reach Compliance Code :
Compliant
Tradename :
SigmaQuad-II
Brand :
GSI Technology
Package / Case :
BGA-165
Memory Organization :
1M x 18
Supply Voltage-Max (Vsup) :
1.9 V
Package :
Tray
Pbfree Code :
yes
Pin Count :
165
Width :
13 mm
Type :
SigmaQuad-II
Base Product Number :
GS8182D18
Product Category :
SRAM
Technology :
SRAM - Quad Port, Synchronous
Memory Format :
SRAM
Series :
GS8182D18BGD
Write Cycle Time - Word, Page :
-
Clock Frequency :
300 MHz
Memory Size :
18 Mbit
Additional Feature :
PIPELINED ARCHITECTURE
Operating Temperature :
-40°C ~ 85°C (TA)
RoHS :
Details
Temperature Grade :
Industrial
Terminal Pitch :
1 mm
Memory Type :
DDR
Parallel/Serial :
Parallel
Packaging :
Tray
JESD-30 Code :
R-PBGA-B165
Maximum Operating Temperature :
+ 85 C
Mounting Type :
Surface Mount
Datasheets
GS8182D18BGD-300I
Introducing Memory GSI Technology GS8182D18BGD-300I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:BGA-165, Type:SigmaQuad-II, Operating Temperature:-40°C ~ 85°C (TA), Mounting Type:Surface Mount, GS8182D18BGD-300I pinout, GS8182D18BGD-300I datasheet PDF, GS8182D18BGD-300I amp .Beyond Memory GSI Technology GS8182D18BGD-300I ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

GSI Technology GS8182D18BGD-300I


Memory GSI Technology GS8182D18BGD-300I Overview

Introducing the Memory GSI Technology GS8182D18BGD-300I, a high-performance 18Mbit SRAM device, designed to meet the rigorous speed and capacity needs of advanced computing environments. Manufactured by GSI Technology, this IC SRAM integrates seamlessly into various applications, providing robust data integrity and faster access times with its parallel interface encapsulated in a 165FPBGA package. Ideal for clients needing bulk quantities for high-speed operations, this memory module enhances system reliability and efficiency, essential for competitive hardware development and deployment.

GS8182D18BGD-300I Features

The GS8182D18BGD-300I boasts several key features that make it a standout option for memory-intensive applications. Its large 18Mbit capacity is perfect for demanding processes, while the parallel interface ensures high-speed data transfer rates. The 165FPBGA packaging not only offers a compact footprint but also enhances thermal management and reliability under varied operational conditions. This module is designed for easy integration into existing architectures, supporting a wide range of voltages and providing flexibility in power management.

GS8182D18BGD-300I Applications

  • Networking Equipment: Utilized in routers and switches, the GS8182D18BGD-300I helps in managing data flow efficiently, ensuring high-speed data processing and improved bandwidth capacity.
  • Telecommunications: Applied in telecom infrastructure, this SRAM supports faster processing capabilities essential for real-time communication applications and high-speed data exchanges.
  • Automotive Systems: Integrates into automotive electronics, providing the necessary speed and reliability for advanced driver-assistance systems (ADAS) and other in-vehicle networks.
  • Industrial Automation: Enhances the performance of automated machinery and control systems, offering quick access to data and reliable operation in critical industrial applications.
  • High-Performance Computing: Ideal for use in servers and supercomputers, where rapid data retrieval and high-density memory storage are crucial.
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