CY7C1370KV33-167BZXC
- Mfr.Part #
- CY7C1370KV33-167BZXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165FBGA
- Stock
- 3,429
- In Stock :
- 3,429
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Voltage - Supply :
- 3.135V~3.6V
- Memory Width :
- 36
- Supply Voltage :
- 3.3V
- Memory Format :
- SRAM
- Series :
- NoBL™
- Organization :
- 512KX36
- Length :
- 15mm
- ECCN Code :
- 3A991.B.2.B
- Terminal Position :
- BOTTOM
- RoHS Status :
- ROHS3 Compliant
- Clock Frequency :
- 167MHz
- Number of Functions :
- 1
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Factory Lead Time :
- 6 Weeks
- Operating Temperature :
- 0°C~70°C TA
- Package / Case :
- 165-LBGA
- Mounting Type :
- Surface Mount
- Width :
- 13mm
- Height Seated (Max) :
- 1.4mm
- Memory Interface :
- Parallel
- Memory Size :
- 18Mb 512K x 36
- Terminal Pitch :
- 1mm
- Memory Type :
- Volatile
- Access Time :
- 3.4ns
- Packaging :
- Tray
- Memory Density :
- 18874368 bit
- Additional Feature :
- PIPELINED ARCHITECTURE
- Number of Terminations :
- 165
- HTS Code :
- 8542.32.00.41
- Published :
- 2011
- Number of Pins :
- 165
- Supply Voltage-Max (Vsup) :
- 3.6V
- Surface Mount :
- yes
- Supply Voltage-Min (Vsup) :
- 3.135V
- Datasheets
- CY7C1370KV33-167BZXC

Memory Infineon Technologies CY7C1370KV33-167BZXC Overview
The Infineon Technologies CY7C1370KV33-167BZXC SRAM chip is a high-performance, 18 Mbit memory solution designed for advanced computing and storage applications requiring high speed and large volume data buffering. This memory module is built on a sophisticated 165FBGA (Fine-pitch Ball Grid Array) packaging technology, ensuring a compact footprint and high reliability under varying environmental conditions. As a leading component in the Memory category, the CY7C1370KV33-167BZXC excels in delivering fast data access and low power consumption, making it an ideal choice for designers looking to enhance system performance while maintaining energy efficiency.
CY7C1370KV33-167BZXC Features
The CY7C1370KV33-167BZXC from Infineon Technologies boasts several key features that make it a robust option for high-demand systems. It offers a parallel interface for quick data transfer and integration ease with existing architecture. With a capacity of 18 Mbit and an organization of words, it facilitates efficient data management and retrieval. The chip's high-speed operation is complemented by its reliability and durability, encapsulated in a rugged 165FBGA package that withstands harsh operational environments.
CY7C1370KV33-167BZXC Applications
- High-Performance Computing: Used in servers and workstations to manage large data sets and complex calculations, enhancing overall system speed and reliability.
- Networking Equipment: Applied in routers and switches to facilitate rapid data buffering and processing, crucial for maintaining high-speed network performance.
- Telecommunications Infrastructure: Essential for data storage in telecom operations, where speed and data integrity are paramount for efficient signal processing and management.
- Automotive Electronics: Integrated into automotive systems requiring high-speed data access for advanced driver-assistance systems (ADAS) and other in-vehicle networks.
- Industrial Automation: Plays a crucial role in automation equipment for real-time processing and control, contributing to increased precision and productivity in manufacturing processes.
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Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
















