CY7C1370KV33-167BZXC

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Mfr.Part #
CY7C1370KV33-167BZXC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
3,429
In Stock :
3,429

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Voltage - Supply :
3.135V~3.6V
Memory Width :
36
Supply Voltage :
3.3V
Memory Format :
SRAM
Series :
NoBL™
Organization :
512KX36
Length :
15mm
ECCN Code :
3A991.B.2.B
Terminal Position :
BOTTOM
RoHS Status :
ROHS3 Compliant
Clock Frequency :
167MHz
Number of Functions :
1
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Factory Lead Time :
6 Weeks
Operating Temperature :
0°C~70°C TA
Package / Case :
165-LBGA
Mounting Type :
Surface Mount
Width :
13mm
Height Seated (Max) :
1.4mm
Memory Interface :
Parallel
Memory Size :
18Mb 512K x 36
Terminal Pitch :
1mm
Memory Type :
Volatile
Access Time :
3.4ns
Packaging :
Tray
Memory Density :
18874368 bit
Additional Feature :
PIPELINED ARCHITECTURE
Number of Terminations :
165
HTS Code :
8542.32.00.41
Published :
2011
Number of Pins :
165
Supply Voltage-Max (Vsup) :
3.6V
Surface Mount :
yes
Supply Voltage-Min (Vsup) :
3.135V
Introducing Memory Infineon Technologies CY7C1370KV33-167BZXC from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Package / Case:165-LBGA, Mounting Type:Surface Mount, Number of Terminations:165, Number of Pins:165, CY7C1370KV33-167BZXC pinout, CY7C1370KV33-167BZXC datasheet PDF, CY7C1370KV33-167BZXC amp .Beyond Memory Infineon Technologies CY7C1370KV33-167BZXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1370KV33-167BZXC


Memory Infineon Technologies CY7C1370KV33-167BZXC Overview

The Infineon Technologies CY7C1370KV33-167BZXC SRAM chip is a high-performance, 18 Mbit memory solution designed for advanced computing and storage applications requiring high speed and large volume data buffering. This memory module is built on a sophisticated 165FBGA (Fine-pitch Ball Grid Array) packaging technology, ensuring a compact footprint and high reliability under varying environmental conditions. As a leading component in the Memory category, the CY7C1370KV33-167BZXC excels in delivering fast data access and low power consumption, making it an ideal choice for designers looking to enhance system performance while maintaining energy efficiency.

CY7C1370KV33-167BZXC Features

The CY7C1370KV33-167BZXC from Infineon Technologies boasts several key features that make it a robust option for high-demand systems. It offers a parallel interface for quick data transfer and integration ease with existing architecture. With a capacity of 18 Mbit and an organization of words, it facilitates efficient data management and retrieval. The chip's high-speed operation is complemented by its reliability and durability, encapsulated in a rugged 165FBGA package that withstands harsh operational environments.

CY7C1370KV33-167BZXC Applications

  • High-Performance Computing: Used in servers and workstations to manage large data sets and complex calculations, enhancing overall system speed and reliability.
  • Networking Equipment: Applied in routers and switches to facilitate rapid data buffering and processing, crucial for maintaining high-speed network performance.
  • Telecommunications Infrastructure: Essential for data storage in telecom operations, where speed and data integrity are paramount for efficient signal processing and management.
  • Automotive Electronics: Integrated into automotive systems requiring high-speed data access for advanced driver-assistance systems (ADAS) and other in-vehicle networks.
  • Industrial Automation: Plays a crucial role in automation equipment for real-time processing and control, contributing to increased precision and productivity in manufacturing processes.
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IMPORTANT NOTICE

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Shipping Method

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Shipping Cost

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