CY7C1370KV25-167AXC
- Mfr.Part #
- CY7C1370KV25-167AXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 100-LQFP
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 100TQFP
- Stock
- 235
- In Stock :
- 235
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- HTS Code :
- 8542.32.00.41
- Surface Mount :
- yes
- Factory Lead Time :
- 6 Weeks
- Clock Frequency :
- 167MHz
- Supply Voltage-Min (Vsup) :
- 2.375V
- Series :
- NoBL™
- Terminal Pitch :
- 0.65mm
- Memory Format :
- SRAM
- Memory Size :
- 18Mb 512K x 36
- JESD-30 Code :
- R-PQFP-G100
- Supply Voltage-Max (Vsup) :
- 2.625V
- Memory Type :
- Volatile
- Height Seated (Max) :
- 1.6mm
- Packaging :
- Tray
- Package / Case :
- 100-LQFP
- ECCN Code :
- 3A991.B.2.A
- Number of Functions :
- 1
- Supply Voltage :
- 2.5V
- Operating Temperature :
- 0°C~70°C TA
- Length :
- 20mm
- Number of Terminations :
- 100
- Terminal Position :
- QUAD
- RoHS Status :
- ROHS3 Compliant
- Organization :
- 512KX36
- Width :
- 14mm
- Published :
- 2004
- Mounting Type :
- Surface Mount
- Memory Interface :
- Parallel
- Additional Feature :
- PIPELINED ARCHITECTURE
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Voltage - Supply :
- 2.375V~2.625V
- Access Time :
- 3.4ns
- Memory Density :
- 18874368 bit
- Memory Width :
- 36
- Datasheets
- CY7C1370KV25-167AXC

Memory Infineon Technologies CY7C1370KV25-167AXC Overview
Introducing the CY7C1370KV25-167AXC by Infineon Technologies—a cutting-edge IC SRAM designed to meet the rigorous demands of modern technology applications. With a robust storage capacity of 18Mbit and housed in a compact 100TQFP package, this parallel SRAM is tailored for systems requiring high-speed data access and reliability. The Memory Infineon Technologies CY7C1370KV25-167AXC ensures optimal performance in a variety of challenging environments, making it an ideal choice for B2B customers looking to leverage advanced memory solutions in their products.
CY7C1370KV25-167AXC Features
This product boasts high-speed access time and is constructed using CMOS technology, ensuring low power consumption and high reliability. The 100TQFP packaging not only provides a space-efficient design but also enhances the thermal and electrical performance, making it suitable for dense circuit designs. Moreover, its ability to operate across a wide range of temperatures and its tolerance for environmental variability make it a versatile choice for rigorous applications.
CY7C1370KV25-167AXC Applications
- Networking Equipment: Utilized in routers and switches for fast data caching to enhance network efficiency and speed.
- Telecommunications: Serves as high-speed transient storage in telecom infrastructures, facilitating rapid data transfer and processing.
- Industrial Automation: Improves response times and reliability in industrial control systems, enhancing overall system performance.
- Medical Devices: Supports complex medical imaging systems by accelerating data processing speeds, which is critical for high-resolution imaging applications.
- Aerospace: Used in avionics for real-time data processing and storage, ensuring robust performance under extreme conditions.
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