CY7C1312BV18-250BZC

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Mfr.Part #
CY7C1312BV18-250BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
46,110
In Stock :
46,110

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Voltage - Supply :
1.7V~1.9V
Pin Count :
165
RoHS Status :
Non-RoHS Compliant
Memory Density :
18874368 bit
Memory Interface :
Parallel
Memory Format :
SRAM
Terminal Finish :
TIN LEAD
Memory Type :
Volatile
Package / Case :
165-LBGA
Terminal Position :
BOTTOM
Supply Voltage :
1.8V
JESD-609 Code :
e0
Packaging :
Tray
Peak Reflow Temperature (Cel) :
220
Number of Functions :
1
Memory Size :
18Mb 1M x 18
Number of Terminations :
165
Organization :
1MX18
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Additional Feature :
PIPELINED ARCHITECTURE
Qualification Status :
COMMERCIAL
Memory Width :
18
Reach Compliance Code :
Unknown
Terminal Pitch :
1mm
Mounting Type :
Surface Mount
Operating Temperature :
0°C~70°C TA
Length :
15mm
Width :
13mm
Access Time (Max) :
0.45 ns
Height Seated (Max) :
1.4mm
JESD-30 Code :
R-PBGA-B165
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Supply Voltage-Max (Vsup) :
1.9V
Pbfree Code :
No
Surface Mount :
yes
Supply Voltage-Min (Vsup) :
1.7V
Clock Frequency :
250MHz
Introducing Memory Infineon Technologies CY7C1312BV18-250BZC from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:165-LBGA, Number of Terminations:165, Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, CY7C1312BV18-250BZC pinout, CY7C1312BV18-250BZC datasheet PDF, CY7C1312BV18-250BZC amp .Beyond Memory Infineon Technologies CY7C1312BV18-250BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1312BV18-250BZC


Memory Infineon Technologies CY7C1312BV18-250BZC Overview

The Memory Infineon Technologies CY7C1312BV18-250BZC, manufactured by Infineon Technologies, represents a pinnacle in high-performance SRAM technology. This integrated circuit features an 18Mbit capacity with a parallel interface, encapsulated in a compact 165FBGA package. Designed for applications demanding high speed and low latency, this memory module excels in robustness and reliability. Its significant storage capacity and advanced design make it ideal for sophisticated electronics that require rapid access to large amounts of data, enhancing system performance and efficiency. The device's robust architecture ensures optimal functionality even under stringent conditions, making it a prime choice for high-end industrial applications.

CY7C1312BV18-250BZC Features

This SRAM module boasts several features that set it apart in the market. It operates at a speed of 250 MHz, providing exceptionally fast data access times, which is critical for high-speed computing environments. The 165FBGA packaging is not only space-efficient but also offers enhanced thermal characteristics for better heat dissipation. This module's parallel interface facilitates easier and more flexible integration into existing systems, allowing for broader compatibility and simpler system upgrades.

CY7C1312BV18-250BZC Applications

  • High-Performance Computing: Utilized in server farms and data centers where speed and data integrity are crucial, ensuring efficient handling of large data sets and high-speed data processing.
  • Networking Equipment: Applies in routers and switches to manage buffer memory, aiding in the fast processing and routing of large amounts of network traffic, which is vital for maintaining network efficiency.
  • Telecommunications: Used in telecommunications infrastructure to provide high-speed caching and quick access to routing tables, enhancing signal processing capabilities and response times.
  • Industrial Automation: Serves as process control memory in industrial automation systems, where rapid data access is necessary for real-time system responses, thereby increasing the reliability and efficiency of automated tasks.
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