BAL99,215

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

Peak Reflow Temperature (Cel) :

260

Surface Mount :

yes

Rep Pk Reverse Voltage-Max :

70V

Current - Reverse Leakage @ Vr :

1μA @ 70V

Terminal Position :

Dual

Configuration :

Single

Diode Element Material :

SILICON

Output Current-Max :

0.215A

JESD-609 Code :

e3

Number of Terminations :

3

JESD-30 Code :

R-PDSO-G3

ECCN Code :

EAR99

Speed :

Fast Recovery =< 500ns, > 200mA (Io)

Voltage - DC Reverse (Vr) (Max) :

70V

Power Dissipation-Max :

0.25W

Terminal Form :

Gull wing

Operating Temperature (Max) :

150°C

RoHS Status :

ROHS3 Compliant

Current - Average Rectified (Io) :

215mA DC

Operating Temperature - Junction :

150°C Max

Forward Current :

215mA

Package / Case :

TO-236-3, SC-59, SOT-23-3

Reverse Recovery Time :

4ns

Capacitance @ Vr, F :

1.5pF @ 0V 1MHz

HTS Code :

8541.10.00.70

Voltage - Forward (Vf) (Max) @ If :

1.25V @ 150mA

Packaging :

Tape and Reel (TR)

Number of Elements :

1

Diode Type :

Standard

Time@Peak Reflow Temperature-Max (s) :

30

Factory Lead Time :

4 Weeks

JEDEC-95 Code :

TO-236AB

Terminal Finish :

Tin (Sn)

Mounting Type :

Surface Mount

Base Part Number :

BAL99

Pin Count :

3

Moisture Sensitivity Level (MSL) :

1 (Unlimited)