AS4C32M16MD1-6BCNTR
- Mfr.Part #
- AS4C32M16MD1-6BCNTR
- Manufacturer
- Alliance Memory, Inc.
- Package / Case
- 60-TFBGA
- Datasheet
- Download
- Description
- IC DRAM 512MBIT PARALLEL 60FPBGA
- Stock
- 32,436
- In Stock :
- 32,436
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- Manufacturer :
- Alliance Memory, Inc.
- Product Category :
- Memory
- Memory Format :
- DRAM
- Memory Type :
- Volatile
- Operating Temperature :
- -25°C~85°C TJ
- Memory Size :
- 512Mb 32M x 16
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Package / Case :
- 60-TFBGA
- Published :
- 2014
- Packaging :
- Tape and Reel (TR)
- Access Time :
- 700ps
- Memory Interface :
- Parallel
- RoHS Status :
- RoHS Compliant
- Supplier Device Package :
- 60-FPBGA (8x9)
- Max Operating Temperature :
- 85°C
- Clock Frequency :
- 166MHz
- Frequency :
- 166MHz
- Voltage - Supply :
- 1.7V~1.9V
- Mounting Type :
- Surface Mount
- Min Operating Temperature :
- -25°C
- Write Cycle Time - Word, Page :
- 15ns
- Interface :
- Parallel
- Datasheets
- AS4C32M16MD1-6BCNTR

Memory Alliance Memory, Inc. AS4C32M16MD1-6BCNTR Overview
The Memory Alliance Memory, Inc. AS4C32M16MD1-6BCNTR is a high-performance 512Mbit DRAM integrated circuit designed for demanding applications requiring large, fast memory solutions. This memory module, encapsulated in a compact 60-ball FPBGA package, is engineered to deliver exceptional speed and reliability, making it an ideal choice for manufacturers aiming to enhance their systems with robust memory capabilities. The high data bandwidth and low latency of this DRAM make it especially suitable for advanced computing and high-speed data processing environments.
AS4C32M16MD1-6BCNTR Features
This DRAM IC offers a parallel interface, ensuring quick data access and high throughput, which is critical in performance-intensive applications. Its compact 60FPBGA package not only minimizes space on the printed circuit board but also enhances thermal performance, crucial for maintaining stability and efficiency in tight spaces.
AS4C32M16MD1-6BCNTR Applications
- Advanced Computing Systems: Utilized in servers and high-performance computers, this DRAM supports system speed enhancements and increased multitasking capabilities.
- Telecommunication Equipment: Essential for telecom infrastructures where large memory bandwidth and capacity are needed to manage vast amounts of data and high-speed communications.
- Automotive Electronics: Used in automotive systems that require robust memory solutions for advanced driver-assistance systems (ADAS) and infotainment systems, ensuring reliability and performance in critical applications.
- Consumer Electronics: Implements in devices like high-end gaming consoles and smart TVs, providing the necessary speed and capacity for enriched multimedia experiences and complex graphics processing.
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