70V639S12BFI
- Mfr.Part #
- 70V639S12BFI
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- 208-LFBGA
- Datasheet
- Download
- Description
- IC SRAM 2.25MBIT PAR 208CABGA
- Stock
- 34,509
- In Stock :
- 34,509
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Memory
- Write Cycle Time - Word, Page :
- 12ns
- Base Part Number :
- IDT70V639
- Memory Interface :
- Parallel
- Memory Format :
- SRAM
- Memory Size :
- 2.25Mb 128K x 18
- Factory Lead Time :
- 17 Weeks
- Packaging :
- Tape and Reel (TR)
- Operating Temperature :
- -40°C~85°C TA
- Voltage - Supply :
- 3.15V~3.45V
- Package / Case :
- 208-LFBGA
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RoHS Status :
- Non-RoHS Compliant
- Memory Type :
- Volatile
- Mounting Type :
- Surface Mount
- Datasheets
- 70V639S12BFI

Memory Intersil (Renesas Electronics Corporation) 70V639S12BFI Overview
Introducing the Memory Intersil (Renesas Electronics Corporation) 70V639S12BFI, a high-performance integrated circuit that exemplifies cutting-edge SRAM technology. This IC boasts a substantial 2.25Mbit storage capacity, housed within a robust 208-pin CABGA package, ensuring both durability and functionality in demanding applications. Designed to meet the rigorous standards of today's technology needs, this SRAM module provides fast access times and reliable data retention, making it an ideal choice for developers and engineers looking for efficient, high-speed memory solutions. The 70V639S12BFI is optimized for applications requiring quick data access and high-volume storage, contributing significantly to system performance improvements in a variety of industrial and commercial devices.
70V639S12BFI Features
The 70V639S12BFI IC SRAM from Renesas features advanced capabilities that enhance its usability in complex applications. This includes a parallel interface for swift data transfer, low latency and high throughput, which are critical for performance-critical environments. The compact 208CABGA package is designed to minimize space on the PCB while providing ample functionality, making it a versatile choice for designers. Additionally, its robust architecture ensures that it can operate under extended temperature ranges, which is crucial for reliability and longevity in harsh environments.
70V639S12BFI Applications
- Networking Equipment: Utilized in routers and switches to manage data efficiently, ensuring high-speed data processing and storage.
- Telecommunications Systems: Acts as a buffer memory in telecom infrastructures, facilitating rapid access and processing of information, enhancing communication reliability and speed.
- Industrial Automation: Integrated in control systems for real-time processing and storage of operational data, improving system responsiveness and process control.
- Aerospace and Defense: Used in avionics for data buffering and real-time critical mission data processing, where reliability and speed are paramount.
- Consumer Electronics: Employed in devices such as high-performance gaming consoles and smart TVs, where quick memory access enhances user experience.
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