70V639S12BFI

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Mfr.Part #
70V639S12BFI
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
208-LFBGA
Datasheet
Download
Description
IC SRAM 2.25MBIT PAR 208CABGA
Stock
34,509
In Stock :
34,509

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Write Cycle Time - Word, Page :
12ns
Base Part Number :
IDT70V639
Memory Interface :
Parallel
Memory Format :
SRAM
Memory Size :
2.25Mb 128K x 18
Factory Lead Time :
17 Weeks
Packaging :
Tape and Reel (TR)
Operating Temperature :
-40°C~85°C TA
Voltage - Supply :
3.15V~3.45V
Package / Case :
208-LFBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
Non-RoHS Compliant
Memory Type :
Volatile
Mounting Type :
Surface Mount
Datasheets
70V639S12BFI
Introducing Memory Intersil (Renesas Electronics Corporation) 70V639S12BFI from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:IDT70V639, Operating Temperature:-40°C~85°C TA, Package / Case:208-LFBGA, Mounting Type:Surface Mount, 70V639S12BFI pinout, 70V639S12BFI datasheet PDF, 70V639S12BFI amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V639S12BFI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V639S12BFI


Memory Intersil (Renesas Electronics Corporation) 70V639S12BFI Overview

Introducing the Memory Intersil (Renesas Electronics Corporation) 70V639S12BFI, a high-performance integrated circuit that exemplifies cutting-edge SRAM technology. This IC boasts a substantial 2.25Mbit storage capacity, housed within a robust 208-pin CABGA package, ensuring both durability and functionality in demanding applications. Designed to meet the rigorous standards of today's technology needs, this SRAM module provides fast access times and reliable data retention, making it an ideal choice for developers and engineers looking for efficient, high-speed memory solutions. The 70V639S12BFI is optimized for applications requiring quick data access and high-volume storage, contributing significantly to system performance improvements in a variety of industrial and commercial devices.

70V639S12BFI Features

The 70V639S12BFI IC SRAM from Renesas features advanced capabilities that enhance its usability in complex applications. This includes a parallel interface for swift data transfer, low latency and high throughput, which are critical for performance-critical environments. The compact 208CABGA package is designed to minimize space on the PCB while providing ample functionality, making it a versatile choice for designers. Additionally, its robust architecture ensures that it can operate under extended temperature ranges, which is crucial for reliability and longevity in harsh environments.

70V639S12BFI Applications

  • Networking Equipment: Utilized in routers and switches to manage data efficiently, ensuring high-speed data processing and storage.
  • Telecommunications Systems: Acts as a buffer memory in telecom infrastructures, facilitating rapid access and processing of information, enhancing communication reliability and speed.
  • Industrial Automation: Integrated in control systems for real-time processing and storage of operational data, improving system responsiveness and process control.
  • Aerospace and Defense: Used in avionics for data buffering and real-time critical mission data processing, where reliability and speed are paramount.
  • Consumer Electronics: Employed in devices such as high-performance gaming consoles and smart TVs, where quick memory access enhances user experience.
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