5SGXMA3E1H29C2LN

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Mfr.Part #
5SGXMA3E1H29C2LN
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 600 I/O 780HBGA
Stock
31,765
In Stock :
31,765

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Height Seated (Max) :
3.6mm
Power Supplies :
0.851.52.52.5/31.2/3V
Number of Inputs :
360
Packaging :
Tray
Organization :
12830 CLBS
Terminal Pitch :
1mm
Mounting Type :
Surface Mount
Terminal Form :
Ball
HTS Code :
8542.39.00.01
Width :
33mm
Number of I/O :
360
Surface Mount :
yes
RoHS Status :
RoHS Compliant
Number of Terminations :
780
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Package / Case :
780-BBGA, FCBGA
Base Part Number :
5SGXMA3
Number of Logic Elements/Cells :
340000
JESD-30 Code :
S-PBGA-B780
Operating Temperature :
0°C~85°C TJ
Series :
Stratix® V GX
Terminal Position :
BOTTOM
Length :
33mm
Factory Lead Time :
8 Weeks
Voltage - Supply :
0.82V~0.88V
Total RAM Bits :
19456000
Qualification Status :
Not Qualified
Supply Voltage :
0.85V
Number of Outputs :
360
Number of LABs/CLBs :
128300
Datasheets
5SGXMA3E1H29C2LN
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMA3E1H29C2LN from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:780, Package / Case:780-BBGA, FCBGA, Base Part Number:5SGXMA3, Operating Temperature:0°C~85°C TJ, 5SGXMA3E1H29C2LN pinout, 5SGXMA3E1H29C2LN datasheet PDF, 5SGXMA3E1H29C2LN amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMA3E1H29C2LN ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGXMA3E1H29C2LN


FPGAs Altera (Intel) 5SGXMA3E1H29C2LN Overview

The FPGAs Altera (Intel) 5SGXMA3E1H29C2LN is a high-performance integrated circuit designed for advanced digital processing. This FPGA, made by the renowned manufacturer Altera, now part of Intel, offers a flexible and powerful solution for handling complex logic operations and data processing in real-time environments. The 5SGXMA3E1H29C2LN model is built to support a wide array of applications from industrial to advanced computational systems, providing designers with the ability to optimize system performance and power efficiency. Its 600 I/O capability housed in a 780HBGA package enables substantial connectivity, essential for high-throughput systems.

5SGXMA3E1H29C2LN Features

  • 600 programmable I/O pins allowing for versatile interfacing with other system components.
  • Advanced 780HBGA packaging ensures robust physical integration while maintaining high signal integrity.
  • Optimized for power efficiency, essential for reducing operational costs in complex applications.
  • Supports a variety of logic density configurations, which makes it highly adaptable for multiple project requirements.

5SGXMA3E1H29C2LN Applications

  • Data Centers: Utilized in server architectures to manage data flow and optimize storage solutions efficiently.
  • Telecommunications: Helps in managing signal processing tasks and network traffic control crucial for maintaining system integrity in communication infrastructure.
  • Automotive: Employed in driver assistance systems to process real-time data from sensors and cameras, enhancing vehicle safety and functionality.
  • Medical Imaging: Key component in advanced imaging devices such as MRI and CT scanners, where high-speed data processing is critical for creating precise images.
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