5SGSMD3E2H29C1N

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Mfr.Part #
5SGSMD3E2H29C1N
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 360 I/O 780HBGA
Stock
45,497
In Stock :
45,497

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Number of I/O :
360
Operating Temperature :
0°C~85°C TJ
Width :
33mm
RoHS Status :
RoHS Compliant
Number of Outputs :
360
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Supply Voltage :
0.9V
Number of Logic Elements/Cells :
236000
Factory Lead Time :
8 Weeks
Terminal Position :
BOTTOM
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
Power Supplies :
0.91.52.52.5/31.2/3V
Series :
Stratix® V GS
Voltage - Supply :
0.87V~0.93V
Number of Inputs :
360
Qualification Status :
Not Qualified
Number of LABs/CLBs :
89000
Surface Mount :
yes
Terminal Pitch :
1mm
Packaging :
Tray
Base Part Number :
5SGSMD3
Length :
33mm
Total RAM Bits :
13312000
Height Seated (Max) :
3.6mm
Package / Case :
780-BBGA, FCBGA
Number of Terminations :
780
Terminal Form :
Ball
Organization :
8900 CLBS
JESD-30 Code :
S-PBGA-B780
HTS Code :
8542.39.00.01
Datasheets
5SGSMD3E2H29C1N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E2H29C1N from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Base Part Number:5SGSMD3, Package / Case:780-BBGA, FCBGA, Number of Terminations:780, 5SGSMD3E2H29C1N pinout, 5SGSMD3E2H29C1N datasheet PDF, 5SGSMD3E2H29C1N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E2H29C1N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGSMD3E2H29C1N


FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E2H29C1N Overview

The FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E2H29C1N is a highly versatile and powerful integrated circuit designed for applications requiring high-speed data processing and flexible hardware configuration. Manufactured by Intel, formerly known as Altera, this FPGA stands out with its robust feature set and adaptability, making it an ideal solution for a wide range of industrial and technological applications. Its large number of I/O pins and high-density ball grid array (BGA) packaging ensure that it can handle complex and multi-faceted tasks efficiently and reliably.

5SGSMD3E2H29C1N Features

This particular model of FPGA offers 360 I/O pins encased in a 780-pin high-density BGA package, which facilitates dense and compact PCB design while providing ample room for interfacing with other crucial components. The device is engineered to support high-speed digital signal processing, which makes it perfect for applications requiring rapid data manipulation and throughput. Enhanced with state-of-the-art technology from Intel, it promises not only performance but also long-term reliability and scalability.

5SGSMD3E2H29C1N Applications

  • Telecommunications: Utilized in routers, switches, and other network equipment to process high volumes of data and manage multiple data streams effectively.
  • Automotive: Employed in driver assistance systems to perform real-time processing of sensor data, enhancing vehicle safety and performance.
  • Data Centers: Critical in managing the infrastructure of modern data centers, handling high-speed data processing tasks, and supporting large-scale server operations.
  • Medical Devices: Integral to the operation of complex medical imaging systems, such as MRI and ultrasound machines, providing the necessary computational power for detailed image analysis and diagnostics.
  • Industrial Automation: Key component in control systems for automating manufacturing processes, improving efficiency and precision in factories.
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