23LCV1024-I/P
- Mfr.Part #
- 23LCV1024-I/P
- Manufacturer
- Microchip Technology
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC SRAM 1MBIT SPI/DUAL I/O 8DIP
- Stock
- 17
- In Stock :
- 17
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- Manufacturer :
- Microchip Technology
- Product Category :
- Memory
- Standby Current-Max :
- 0.00001 A
- Terminal Form :
- THROUGH-HOLE
- Address Bus Width :
- 24b
- Type :
- SYNCHRONOUS
- Product Status :
- Active
- Number of Terminations :
- 8
- Timing Type :
- SYNCHRONOUS
- Standby Voltage-Min :
- 2.5V
- Operating Supply Voltage (Min) :
- 2.5(V)
- Supplier Device Package :
- 8-DIP
- Surface Mount :
- No
- Radiation Hardening :
- No
- Terminal Finish :
- Matte Tin (Sn) - annealed
- JESD-609 Code :
- e3
- Density :
- 1 Mb
- Package :
- Tube
- Seated Height-Max :
- 5.334 mm
- Operating Supply Voltage (Max) :
- 5.5(V)
- Maximum Operating Temperature :
- +85 °C
- Base Part Number :
- 23LCV1024
- Supply Voltage-Max (Vsup) :
- 5.5V
- Mounting Type :
- Through Hole
- Mounting :
- Through Hole
- Package Type :
- PDIP
- Number of Terminals :
- 8
- Product Category :
- SRAM
- Pin Count :
- 8
- Clock Freq :
- 20(MHz)
- Memory Type :
- Non-Volatile
- Packaging :
- Tube
- REACH SVHC :
- No SVHC
- Operating Mode :
- SYNCHRONOUS
- Terminal Pitch :
- 2.54mm
- Mounting Style :
- Through Hole
- Interface :
- SPI
- Reach Compliance Code :
- Compliant
- MSL :
- -
- Number of Pins :
- 8
- Minimum Operating Temperature :
- -40 °C
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Memory IC Type :
- STANDARD SRAM
- Minimum Operating Supply Voltage :
- 2.5 V
- Manufacturer :
- Microchip
- Height :
- 4.953mm
- Product Type :
- SRAM
- Number of Words :
- 128K
- Terminal Position :
- Dual
- Clock Frequency :
- 20MHz
- Supply Voltage-Min (Vsup) :
- 2.5V
- Number of I/O Lines :
- 8
- Operating Temperature :
- -40°C~85°C TA
- RoHS :
- Details
- Dimensions :
- 10.16 x 7.11 x 4.95mm
- JESD-30 Code :
- R-PDIP-T8
- Parallel/Serial :
- Serial
- Rad Hardened :
- No
- Peak Reflow Temperature (Cel) :
- Not Applicable
- Factory Lead Time :
- 14 Weeks
- Memory Format :
- NVSRAM
- Write Cycle Time - Word, Page :
- --
- Supply Current :
- 10
- Organization :
- 128 k x 8
- Number of Ports :
- 1
- Power Supplies :
- 3/5V
- Address Bus :
- 24(b)
- Number of Functions :
- 1
- Memory Size :
- 1Mb 128K x 8
- I/O Type :
- Separate
- Length :
- 10.16mm
- Word Size :
- 8B
- Memory Organization :
- 128K x 8
- Memory Density :
- 1
- Width :
- 7.112mm
- Nominal Supply Current :
- 10mA
- Operating Temp Range :
- -40C to 85C
- Published :
- 2007
- Output Characteristics :
- 3-STATE
- Sync/Async :
- SYNCHRONOUS
- Interface Type :
- SDI, SPI
- Qualification Status :
- Not Qualified
- Operating Supply Voltage (Typ) :
- 3.3/5(V)
- Package Shape :
- RECTANGULAR
- Access Time :
- 25 ns
- Supply Current-Max :
- 0.01 mA
- Memory Width :
- 8
- Maximum Operating Supply Voltage :
- 5.5 V
- RoHS Status :
- ROHS3 Compliant
- Base Product Number :
- 23LCV1024
- Temperature Grade :
- Industrial
- Operating Temperature Classification :
- Industrial
- Voltage - Supply :
- 2.5V~5.5V
- Memory Interface :
- SPI - Dual I/O
- Series :
- --
- Brand :
- Microchip Technology / Atmel
- Package / Case :
- 8-DIP (0.300, 7.62mm)
- Datasheets
- 23LCV1024-I/P

Memory Microchip Technology 23LCV1024-I/P Overview
The Memory Microchip Technology 23LCV1024-I/P is a high-performance integrated circuit designed for storage applications. Manufactured by Microchip Technology, this IC offers 1MBIT of SRAM capacity and utilizes SPI/DUAL I/O communication protocols. Encased in an 8DIP package, it provides reliable and efficient data storage solutions for various electronic devices.
23LCV1024-I/P Features
- 1MBIT SRAM capacity
- SPI/DUAL I/O communication
- 8DIP package for easy integration
- High-performance and reliable operation
- Low-power consumption
- Wide range of operating voltage: 2.5V - 5.5V
- Fast access time
- Extended temperature range
- Robust design for industrial applications
23LCV1024-I/P Applications
- Data storage modules: The 23LCV1024-I/P is commonly used in data storage modules for various electronic devices such as IoT devices, industrial equipment, and consumer electronics. Its high-capacity and reliable operation make it ideal for storing critical data and configurations.
- Embedded systems: This IC is widely applied in embedded systems where fast and efficient data storage is required. It serves as a buffer for temporary data storage, facilitating smooth operation and data processing in embedded applications.
- Automotive electronics: In automotive electronics, the 23LCV1024-I/P finds use in applications requiring reliable data storage in harsh environments. Its robust design and extended temperature range make it suitable for automotive systems where durability and performance are paramount.
- Medical devices: Medical devices often rely on high-performance data storage solutions to store patient data, logs, and configurations. The 23LCV1024-I/P meets these requirements with its fast access time, low-power consumption, and secure data storage capabilities, making it a preferred choice for medical device manufacturers.
- Industrial control systems: Industrial control systems demand reliable and robust data storage solutions to ensure smooth and uninterrupted operation. The 23LCV1024-I/P offers high-performance SRAM storage with SPI/DUAL I/O communication, making it well-suited for use in industrial control applications.
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