23LCV1024-I/P

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Mfr.Part #
23LCV1024-I/P
Manufacturer
Microchip Technology
Package / Case
8-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC SRAM 1MBIT SPI/DUAL I/O 8DIP
Stock
17
In Stock :
17

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Manufacturer :
Microchip Technology
Product Category :
Memory
Standby Current-Max :
0.00001 A
Terminal Form :
THROUGH-HOLE
Address Bus Width :
24b
Type :
SYNCHRONOUS
Product Status :
Active
Number of Terminations :
8
Timing Type :
SYNCHRONOUS
Standby Voltage-Min :
2.5V
Operating Supply Voltage (Min) :
2.5(V)
Supplier Device Package :
8-DIP
Surface Mount :
No
Radiation Hardening :
No
Terminal Finish :
Matte Tin (Sn) - annealed
JESD-609 Code :
e3
Density :
1 Mb
Package :
Tube
Seated Height-Max :
5.334 mm
Operating Supply Voltage (Max) :
5.5(V)
Maximum Operating Temperature :
+85 °C
Base Part Number :
23LCV1024
Supply Voltage-Max (Vsup) :
5.5V
Mounting Type :
Through Hole
Mounting :
Through Hole
Package Type :
PDIP
Number of Terminals :
8
Product Category :
SRAM
Pin Count :
8
Clock Freq :
20(MHz)
Memory Type :
Non-Volatile
Packaging :
Tube
REACH SVHC :
No SVHC
Operating Mode :
SYNCHRONOUS
Terminal Pitch :
2.54mm
Mounting Style :
Through Hole
Interface :
SPI
Reach Compliance Code :
Compliant
MSL :
-
Number of Pins :
8
Minimum Operating Temperature :
-40 °C
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Memory IC Type :
STANDARD SRAM
Minimum Operating Supply Voltage :
2.5 V
Manufacturer :
Microchip
Height :
4.953mm
Product Type :
SRAM
Number of Words :
128K
Terminal Position :
Dual
Clock Frequency :
20MHz
Supply Voltage-Min (Vsup) :
2.5V
Number of I/O Lines :
8
Operating Temperature :
-40°C~85°C TA
RoHS :
Details
Dimensions :
10.16 x 7.11 x 4.95mm
JESD-30 Code :
R-PDIP-T8
Parallel/Serial :
Serial
Rad Hardened :
No
Peak Reflow Temperature (Cel) :
Not Applicable
Factory Lead Time :
14 Weeks
Memory Format :
NVSRAM
Write Cycle Time - Word, Page :
--
Supply Current :
10
Organization :
128 k x 8
Number of Ports :
1
Power Supplies :
3/5V
Address Bus :
24(b)
Number of Functions :
1
Memory Size :
1Mb 128K x 8
I/O Type :
Separate
Length :
10.16mm
Word Size :
8B
Memory Organization :
128K x 8
Memory Density :
1
Width :
7.112mm
Nominal Supply Current :
10mA
Operating Temp Range :
-40C to 85C
Published :
2007
Output Characteristics :
3-STATE
Sync/Async :
SYNCHRONOUS
Interface Type :
SDI, SPI
Qualification Status :
Not Qualified
Operating Supply Voltage (Typ) :
3.3/5(V)
Package Shape :
RECTANGULAR
Access Time :
25 ns
Supply Current-Max :
0.01 mA
Memory Width :
8
Maximum Operating Supply Voltage :
5.5 V
RoHS Status :
ROHS3 Compliant
Base Product Number :
23LCV1024
Temperature Grade :
Industrial
Operating Temperature Classification :
Industrial
Voltage - Supply :
2.5V~5.5V
Memory Interface :
SPI - Dual I/O
Series :
--
Brand :
Microchip Technology / Atmel
Package / Case :
8-DIP (0.300, 7.62mm)
Datasheets
23LCV1024-I/P
Introducing Memory Microchip Technology 23LCV1024-I/P from Chip IC,where excellence meets affordability. This product stands out with its Type:SYNCHRONOUS, Number of Terminations:8, Base Part Number:23LCV1024, Mounting Type:Through Hole, Number of Pins:8, Operating Temperature:-40°C~85°C TA, Package / Case:8-DIP (0.300, 7.62mm), 23LCV1024-I/P pinout, 23LCV1024-I/P datasheet PDF, 23LCV1024-I/P amp .Beyond Memory Microchip Technology 23LCV1024-I/P ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology 23LCV1024-I/P


Memory Microchip Technology 23LCV1024-I/P Overview

The Memory Microchip Technology 23LCV1024-I/P is a high-performance integrated circuit designed for storage applications. Manufactured by Microchip Technology, this IC offers 1MBIT of SRAM capacity and utilizes SPI/DUAL I/O communication protocols. Encased in an 8DIP package, it provides reliable and efficient data storage solutions for various electronic devices.

23LCV1024-I/P Features

  • 1MBIT SRAM capacity
  • SPI/DUAL I/O communication
  • 8DIP package for easy integration
  • High-performance and reliable operation
  • Low-power consumption
  • Wide range of operating voltage: 2.5V - 5.5V
  • Fast access time
  • Extended temperature range
  • Robust design for industrial applications

23LCV1024-I/P Applications

  • Data storage modules: The 23LCV1024-I/P is commonly used in data storage modules for various electronic devices such as IoT devices, industrial equipment, and consumer electronics. Its high-capacity and reliable operation make it ideal for storing critical data and configurations.
  • Embedded systems: This IC is widely applied in embedded systems where fast and efficient data storage is required. It serves as a buffer for temporary data storage, facilitating smooth operation and data processing in embedded applications.
  • Automotive electronics: In automotive electronics, the 23LCV1024-I/P finds use in applications requiring reliable data storage in harsh environments. Its robust design and extended temperature range make it suitable for automotive systems where durability and performance are paramount.
  • Medical devices: Medical devices often rely on high-performance data storage solutions to store patient data, logs, and configurations. The 23LCV1024-I/P meets these requirements with its fast access time, low-power consumption, and secure data storage capabilities, making it a preferred choice for medical device manufacturers.
  • Industrial control systems: Industrial control systems demand reliable and robust data storage solutions to ensure smooth and uninterrupted operation. The 23LCV1024-I/P offers high-performance SRAM storage with SPI/DUAL I/O communication, making it well-suited for use in industrial control applications.
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