2320-6221-TG
- Mfr.Part #
- 2320-6221-TG
- Manufacturer
- 3M
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 20POS 2.54MM
- Stock
- 688
- In Stock :
- 688
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- Manufacturer :
- 3M
- Product Category :
- Headers, Male Pins
- Number of Positions :
- 20
- Factory Lead Time :
- 9 Weeks
- Termination :
- Solder
- Contact Finish - Mating :
- Gold
- Contact Length - Mating :
- 0.318 8.08mm
- Series :
- 2300
- Contact Finish - Post :
- Tin-Lead
- Mounting Type :
- Through Hole
- Insulation Height :
- 0.100 2.54mm
- Contact Finish Thickness - Post :
- 100.0μin 2.54μm
- Contact Finish Thickness - Mating :
- 10.0μin 0.25μm
- Contact Material :
- COPPER ALLOY
- Number of Rows :
- 2
- Contact Length - Post :
- 0.120 3.05mm
- Current Rating (Amps) :
- 3A
- Published :
- 2008
- Style :
- Board to Board or Cable
- Insulation Material :
- Thermoplastic, Glass Filled
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Connector Type :
- Header
- Pitch - Mating :
- 0.100 2.54mm
- Insulation Color :
- Black
- Number of Positions Loaded :
- All
- Shrouding :
- Unshrouded
- Material Flammability Rating :
- UL94 V-0
- Packaging :
- Bulk
- Fastening Type :
- Push-Pull
- Overall Contact Length :
- 0.538 13.67mm
- Operating Temperature :
- -55°C~105°C
- RoHS Status :
- Non-RoHS Compliant
- Contact Shape :
- Square
- Contact Type :
- Male Pin
- Datasheets
- 2320-6221-TG

2300 Series 2-Row Header Solder Copper Alloy Bulk Through Hole Gold Thermoplastic, Glass Filled 20-Position Board to Board or Cable 0.100 2.54mm Height
2320-6221-TG Overview
The packaging is Header.Mounting type is Through Hole.To package the product, we use a Bulk case.This product is from the 2300 Series.Device runs at -55°C~105°C Operating Temperature.
2320-6221-TG Features
2300 series
2320-6221-TG Applications
There are a lot of 3M
2320-6221-TG Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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