10AX022E3F29I1SG
- Mfr.Part #
- 10AX022E3F29I1SG
- Manufacturer
- Altera (Intel)
- Package / Case
- 780-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 288 I/O 780FBGA
- Stock
- 43,460
- In Stock :
- 43,460
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of LABs/CLBs :
- 80330
- Number of Terminations :
- 780
- Number of Inputs :
- 288
- Number of Outputs :
- 288
- Packaging :
- Tray
- Height Seated (Max) :
- 3.35mm
- HTS Code :
- 8542.39.00.01
- Width :
- 29mm
- Surface Mount :
- yes
- Supply Voltage :
- 0.9V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Voltage - Supply :
- 0.87V~0.93V
- Qualification Status :
- Not Qualified
- Package / Case :
- 780-BBGA, FCBGA
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Total RAM Bits :
- 13752320
- Mounting Type :
- Surface Mount
- Number of I/O :
- 288
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Operating Temperature :
- -40°C~100°C TJ
- JESD-30 Code :
- S-PBGA-B780
- Terminal Pitch :
- 1mm
- Length :
- 29mm
- Terminal Position :
- BOTTOM
- Power Supplies :
- 0.9V
- Series :
- Arria 10 GX
- Terminal Form :
- Ball
- RoHS Status :
- RoHS Compliant
- Number of Logic Elements/Cells :
- 220000
- Datasheets
- 10AX022E3F29I1SG

FPGAs Altera (Intel) 10AX022E3F29I1SG Overview
The FPGAs Altera (Intel) 10AX022E3F29I1SG is a high-performance integrated circuit, specifically designed for the sophisticated needs of modern technology systems. This FPGA from Intel's Altera series boasts versatility and efficiency, suitable for handling complex algorithms and processes. The integration of 288 I/Os packed into a compact 780FBGA package allows for substantial scalability and flexibility in system design. Ideal for designers looking to push the boundaries of innovation, the 10AX022E3F29I1SG offers a robust platform for developing advanced applications in various tech industries.
10AX022E3F29I1SG Features
The 10AX022E3F29I1SG FPGA includes several key features that make it a top choice for system developers. Its 288 input/output ports provide ample connectivity for multiple peripherals and systems, enhancing interface capabilities. The 780FBGA package ensures a dense yet manageable footprint on physical boards, facilitating more efficient layout and design. Additionally, the chip is designed for optimal power management, supporting various power-saving modes to extend device longevity and reduce operational costs.
10AX022E3F29I1SG Applications
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